Low-cost AFM cantilever manufacturing technology

Journal of Micromechanics and Microengineering

Volumn 18, Issue 11, 2008, Pages

  Guerre, Roland ^a   Drechsler, Ute ^a   Jubin, Daniel ^a   Despont, Michel ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ABLATION; ADHESION; ATOMIC FORCE MICROSCOPY; COSTS; LASER ABLATION; NANOCANTILEVERS; PORTABLE EQUIPMENT; PRECISION BALANCES; SEMICONDUCTING SILICON COMPOUNDS; WAFER BONDING;

ADHESIVE PADS; ADHESIVE POLYMERS; AFM CANTILEVERS; DEVICE TRANSFERS; DISTRIBUTION RATIOS; FABRICATION COSTS; HETEROGENEOUS DEVICE INTEGRATIONS; INTER-CONNECTS; MANUFACTURING PROCESSES; MANUFACTURING TECHNOLOGIES; MICRODEVICE; MICRODEVICE FABRICATIONS; MICRODEVICES; QUALITY PARTS; REDUCTION METHODS; SELECTIVE TRANSFERS; STAMPING METHODS; TO MANY;

SILICON WAFERS;

EID: 58149336804     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/11/115013     Document Type: Article

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