Adhesive bonding of InP/InGaAsP dies to processed silicon-on-insulator wafers using DVS-bis-benzocyclobutene

Journal of the Electrochemical Society

Volumn 153, Issue 12, 2006, Pages

  Roelkens, G ^a   Brouckaert, J ^a   Van Thourhout, D ^a   Baets, R ^a   Notzel R ^b   Smit, M ^b  

^a GHENT UNIVERSITY   (Belgium)

^b EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; ELECTROCHEMISTRY; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

ADHESIVE BONDING; BENZOCYCLOBUTENE (BCB); QUALITY BONDING; SILICON-ON-INSULATOR WAFERS;

DIES;

EID: 33750831751     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2352045     Document Type: Article

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