Scalability and low cost of ownership advantages of direct bond interconnect (DBI®) as drivers for volume commercialization of 3-d integration architectures and applications

Materials Research Society Symposium Proceedings

Volumn 1112, Issue , 2009, Pages 33-41

  Enquist, Paul ^a  

^a Ziptronix Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATED CIRCUIT; 3-D INTEGRATION; DIRECT BOND; HETEROGENEOUS MATERIALS; HIGH-THROUGHPUT; LOW COSTS; LOW THERMAL BUDGET;

INTEGRATED CIRCUITS; SCALABILITY; THREE DIMENSIONAL;

COST REDUCTION;

EID: 70449587205     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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