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Volumn 7208, Issue , 2009, Pages

Fabrication of large-scale mono-crystalline silicon micro-mirror arrays using adhesive wafer transfer bonding

Author keywords

Adhesive bonding; Micro mirrors; Optical MEMS; Spatial light modulator

Indexed keywords

ADHESIVE BONDING; BENZOCYCLOBUTENE; BOND PROCESS; BURIED OXIDE LAYERS; CMOS COMPATIBLE; CMOS PROCESS; CMOS WAFERS; CRYSTALLINE SILICONS; DONOR WAFERS; DUV LITHOGRAPHY; FABRICATION PROCESS; FULLY COMPATIBLE; LOW TEMPERATURES; MICRO MIRROR; MICRO MIRRORS; MICROMIRROR ARRAY; MIRROR MATERIALS; OPTICAL MEMS; PLANARITY; SPATIAL LIGHT MODULATOR; SPATIAL LIGHT MODULATORS; THIN SILICON MEMBRANE; WAFER TRANSFERS;

EID: 67649183018     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.808694     Document Type: Conference Paper
Times cited : (10)

References (5)
  • 4
    • 0042889071 scopus 로고    scopus 로고
    • Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding
    • Niklaus, F., Haasl, S. and Stemme, G., "Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding," IEEE/ASME J. of Microelectromechnical Systems, 12(4), 465-469 (2003).
    • (2003) IEEE/ASME J. of Microelectromechnical Systems , vol.12 , Issue.4 , pp. 465-469
    • Niklaus, F.1    Haasl, S.2    Stemme, G.3
  • 5
    • 33644949327 scopus 로고
    • Bonding of silicon wafers for silicon-on-insulator
    • Maszara, W. P., Goetz, G., Caviglia, A., and Mckitterick, J. B.," Bonding of silicon wafers for silicon-on-insulator," J. Appl. Phys. 64 (10), 4943-4950 (1988).
    • (1988) J. Appl. Phys , vol.64 , Issue.10 , pp. 4943-4950
    • Maszara, W.P.1    Goetz, G.2    Caviglia, A.3    Mckitterick, J.B.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.