Design and wafer-level fabrication of SMA wire microactuators on silicon

Journal of Microelectromechanical Systems

Volumn 19, Issue 4, 2010, Pages 982-991

  Clausi, Donato ^a   Gradin, Henrik ^b   Braun, Stefan ^b,c   Peirs, Jan ^a   Stemme, Göran ^b   Reynaerts, Dominiek ^a   Van Der Wijngaart, Wouter ^b  

^a UNIVERSITY OF LEUVEN   (Belgium)

^b ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^c Silex Microsystems AB   (Sweden)

Author keywords

Actuator; adhesive bonding; bias spring; cantilever; microelectromechanical systems (MEMS); NiTi; reset mechanism; shape memory alloy (SMA); silicon structure; SU 8; TiNi; wafer level integration

Indexed keywords

ADHESIVE BONDING; BIAS SPRINGS; CANTILEVER; MICROELECTROMECHANICAL SYSTEMS; SHAPE MEMORY ALLOY; SHAPE MEMORY ALLOY (SMA); SILICON STRUCTURES; WAFER-LEVEL INTEGRATION;

ATOMIC FORCE MICROSCOPY; COMPOSITE MICROMECHANICS; FABRICATION; MATHEMATICAL MODELS; MECHATRONICS; MEMS; MICROACTUATORS; MICROELECTROMECHANICAL DEVICES; NANOCANTILEVERS; PHOTORESISTS; SHAPE MEMORY EFFECT; SILICON ALLOYS; SILICON WAFERS; SPRINGS (COMPONENTS); WIRE;

WAFER BONDING;

EID: 77955414734     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2049474     Document Type: Article

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