Low-temperature intermediate Au-Si wafer bonding; eutectic or silicide bond

Sensors and Actuators, A: Physical

Volumn 62, Issue 1-3, 1997, Pages 680-686

  Wolffenbuttel, Reinoud F ^a,b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Eutectic bonding; Gold; Silicide bonding; Silicon; Wafer bonding

Indexed keywords

ADHESION; CHROMIUM; DIFFUSION IN SOLIDS; EUTECTICS; GOLD; INTERFACES (MATERIALS); LOW TEMPERATURE OPERATIONS; MICROELECTRONIC PROCESSING; SILICON WAFERS; TITANIUM;

EUTECTIC BONDING; SILICIDATION; SILICIDE BONDING; WAFER BONDING;

SOLDERING;

EID: 0031177094     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(97)01550-1     Document Type: Article

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