Low cost of ownership scalable copper direct bond interconnect 3D IC technology for three dimensional integrated circuit applications

2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Volumn , Issue , 2009, Pages

  Enquist, P ^a   Fountain, G ^a   Petteway, C ^a   Hollingsworth, A ^a   Grady, H ^a  

^a Ziptronix Inc   (United States)

Author keywords

Bonding; Direct bond interconnect; Direct bonding; Direct copper bonding; Direct Internal metal thermo compression bonding; Direct metal bonding; Direct oxide bonding; Fine pitch 3D interconnect; Heterogeneous integration; Molecular bonding; Non adhesive bonding; Reliability

Indexed keywords

3D INTERCONNECT; ADHESIVE BONDING; DIRECT BOND; DIRECT BOND INTERCONNECT; DIRECT BONDING; DIRECT INTERNAL METAL THERMO-COMPRESSION BONDING; FINE PITCH; FINE PITCH 3D INTERCONNECT; HETEROGENEOUS INTEGRATION; METAL BONDING; MOLECULAR BONDING; THERMO COMPRESSION BONDING;

BUDGET CONTROL; COPPER; COPPER OXIDES; FLIP CHIP DEVICES; FOUNDRY PRACTICE; INTEGRATED CIRCUITS; METALS; RELIABILITY;

THREE DIMENSIONAL;

EID: 70549095282     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2009.5306533     Document Type: Conference Paper

References (20)

1. P. Enquist, "Direct Bond Interconnect Slashes Large-Die SOC Manufacturing Costs", FSA forum, Fall 2006, p12.
2. Q. Y. Tong, P. M. Enquist, A. S. Rose, U.S. Patent 6,962,835, "Method for Room Temperature Metal Direct Bonding", Issued November 8, 2005.
3. P. Enquist, "Room Temperature Direct Wafer Bonding for Three Dimensional Integrated Sensors", Sensors and Materials, Vol. 17, No. 6, 2005, p. 307.
4. C. Keast, B. Aull, J. Burns, C. Chen, J. Knecht, B. Tyrrell, K. Warner, B. Wheeler, V. Suntharalingam, P. Wyatt, and D. Yost, "Three-Dimensional Integrated Circuit Fabrication Technology for Advanced Focal Planes", MRS Symposium Fall 2006.
5. Q. Y. Tong, "Room Temperature Metal Direct Bonding", Applied Physics Letters, 89, 1, 2006.
6. P. Enquist, "High Density Direct Bond Interconnect (DBI™) Technology for Three Dimensional Integrated Circuit Applications", Fall MRS, 2006.
7. P. Enquist, "Direct Bonding Processes for 3-D Integration", Handbook of 3D Integration, Vol 2, Chapter 11, 2008, p.487.
8. P. Enquist, "Scalability and Low Cost of Ownership Advantages of Direct Bond Interconnect (DBI®) as Drivers for Volume Commercialization of 3-D Integration Architectures and Applications", Mater. Res. Soc. Symp. Proc. Vol. 1112, 2009, p.33.
9. P. Gueguen, L.D. Cioccia, J.P. Gonchond, P.Gergaud, M. Rivoire, D. Scevola, M. Zussy, D. Lafond, L. Clavelier, "3D Vertical Interconnects by Copper Direct Bonding", Mater. Res. Soc. Symp. Proc. Vol. 1112, 2009, p.81.
10. Yole, "3DIC Report", 2007 Edition, Revised August 15, 2008.
11. Q.-Y. Tong, G. Fountain, and P. Enquist, U.S. Patent 6,902,987, "Method for Low Temperature Bonding and Bonded Structure", June 7, 2005.
12. Q.-Y. Tong, G. Fountain, and P. Enquist, U.S. Patent 7,041,178, "Method for Low Temperature Bonding and Bonded Structure", May 9, 2006.
13. Q.-Y. Tong, U.S. Patent 7,109,092, "Method of Room Temperature Covalent Bonding", September 19, 2006.
14. Q.-Y. Tong, G. Fountain, and P. Enquist, U.S. Patent 7,335,572, "Method for Low Temperature Bonding and Bonded Structure", February 26, 2008.
15. Q.-Y. Tong, U.S. Patent 7,335,996, "Method of Room Temperature Covalent Bonding", February 26, 2008.
16. Q.-Y. Tong, G. Fountain, and P. Enquist, U.S. Patent 7,387,994, "Method for Low Temperature Bonding and Bonded Structure", June 17, 2008.
17. Q.-Y. Tong, G. Fountain, and P. Enquist, U.S. Patent 7,553,744, "Method for Low Temperature Bonding and Bonded Structure", June 30 2009.
18. www.ziptronix.com
19. H. Nakajima, Packaging Summit Panel, Semicon, 2009.
20. J. Eischen, private communication.