A new concept for CMOS-compatible fabrication of uncooled infrared focal plane arrays using wafer-scale device transfer bonding

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4369, Issue , 2001, Pages 397-404

  Niklaus, Frank ^a   Kälvesten, Edvard ^a   Stemme, Göran ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Adhesive bonding; Bolometer; CMOS compatible; Infrared detector; Infrared focal plane array; Low temperature; Membrane; Polycrystalline silicon; Transfer bonding; Wafer scale integration

Indexed keywords

ANNEALING; BOLOMETERS; BONDING; CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED OPTOELECTRONICS; LOW TEMPERATURE OPERATIONS; POLYCRYSTALLINE MATERIALS; POLYSILICON; THERMISTORS; TRANSDUCERS; WSI CIRCUITS;

ADHESIVE BONDING; FERROELECTRIC DETECTORS; INFRARED BOLOMETERS; MEMBRANE TRANSFER BONDING; POLYCRYSTALLINE SILICON; UNCOOLED INFRARED FOCAL PLANE ARRAYS; WAFER SCALE DEVICE TRANSFER BONDING;

INFRARED DETECTORS;

EID: 0035761556     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.445334     Document Type: Conference Paper

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