Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2011, Pages 268-271

  Forsberg, F ^a   Roxhed, N ^a   Stemme, G ^a   Niklaus, F ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE WAFER BONDING; BATCH TRANSFER; EVALUATION METHOD; HETEROGENEOUS INTEGRATION; MATRIX; NOVEL METHODS; POSITIONING ACCURACY; STANDARD DEVIATION; WAFER SIZES; WAFER SUBSTRATES;

MECHANICAL ENGINEERING; MECHANICS; MEMS; REACTIVE ION ETCHING; TRANSFER MATRIX METHOD;

WAFER BONDING;

EID: 79953802096     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2011.5734413     Document Type: Conference Paper

References (5)

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2. M. Despont, U. Drechsler, R. Yu, H.B Pogge, P. Vettiger, "Wafer-scale microdevice transfer/interconnect: its application in an AFM-based data-storage system", Journal of Microelectromechanical Systems, Vol.13, No.6, pp.895-901, 2004. (Pubitemid 40009490)
3. R. Guerre, U. Drechsler, D. Jubin, M. Despont, "Selective transfer technology for microdevice distribution", IEEE Journal of Microelectromechanical Systems, Vol.17, No.1, pp.157-165, 2008. (Pubitemid 351343929)
4. M. Smit, J. Brouckaert, D. Van Thourhout, R. Baets, R. Nötzel, G. Roelkens, "Adhesive Bonding of InP/InGaAsP Dies to Processed Silicon-On-Insulator Wafers using DVS-bis-Benzocyclobutene", Journal of The Electrochemical Society, Vol 153, pp. 1015-1019, 2006.
5. F. Niklaus, G. Stemme, J.Q. Lu, and R. J. Gutmann, "Adhesive wafer bonding", J. Appl. Phys., Vol 99, 031101, 2006.