Metallic bonding methodology for heterogeneous integration of optoelectronic dies to CMOS circuits

Microelectronic Engineering

Volumn 85, Issue 4, 2008, Pages 727-732

  Robogiannakis, P ^a   Kyriakis Bitzaros, E D ^a,b   Minoglou, K ^a   Katsafouros, S ^a   Kostopoulos, A ^c   Konstantinidis, G ^c   Halkias, G ^a  

^a INSTITUTE OF MICROELECTRONICS   (Greece)

^b TEI of Piraeus ^*  (Greece)

^c UNIVERSITY OF CRETE   (Greece)

Author keywords

Au Sn alloy; Heterogeneous integration; Metallic bonding; Optoelectronics

Indexed keywords

CMOS INTEGRATED CIRCUITS; OPTOELECTRONIC DEVICES; PARAMETER ESTIMATION; RARE EARTH ELEMENTS; TIN ALLOYS;

HETEROGENEOUS DEVICES; OPTOELECTRONIC DIE;

BONDING;

EID: 40449084997     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.01.053     Document Type: Article

References (25)

1. Semiconductor Industry Association, The International Roadmap for Semiconductors: 2005, Executive Summary, p. 41. .
2. Krishnamorthy A.V., and Miller D.A.B. IEEE Journal on Selected Topics in Quantum Electronics 2 1 (1995) 55
3. Jokerst N.M., Brooke M.A., Cho S.Y., Wilkinson S., Vrazel M., Fike S., Tabler J., Joo Y.J., Seo S.W., Wills D.S., and Brown A. IEEE Journal on Selected Topics in Quantum Electronics 9 2 (2003) 350
4. Kyriakis-Bitzaros E.D., Haralabidis N., Lagadas M., Georgakilas A., Moisiadis Y., and Halkias G. IEEE Journal of Lightwave Technology 19 10 (2001) 1532
5. Kyriakis-Bitzaros E.D., and Halkias G. In: Alexe M., and Gösele U. (Eds). Wafer Bonding Applications and Technology (2004), Springer 359 Chapter 10
6. Mathine D.L. IEEE Journal on Selected Topics in Quantum Electronics 3 3 (1997) 952
7. Cook C., Cunningham J.E., Hargrove A., Ger G.G., Goosen K.W., Jan W.Y., Kim H.H., Krause R., Manges M., Morrissey M., Perinpanayagam M., Persaud A., Shevchuk G.J., Sinyansky V., and Krishnamorthy A.V. IEEE Journal on Selected Topics in Quantum Electronics 9 2 (2003) 387
8. Chen R., Chin H., Miller D.A.B., Ma K., and Harris J.S. IEEE Photonics Technology Letters 17 6 (2005) 1271
9. Jokerst N.M., Brooke M.A., Laskar J., Wills D.S., Brown A.S., Vrazel M., Jung S., Joo Y., and Chang J.J. IEEE Journal on Selected Topics in Quantum Electronics 6 6 (2000) 1231
10. Plant D.V., Venditti M.B., Laprise E., Faucher J., Razavi K., Chateauneuf M., Kirk A.G., and Ahearn J.S. IEEE Journal of Lightwave Technology 19 8 (2001) 1093
11. Worchesky T.L., Ritter K.J., Martin R., and Lane B. Applied Optics 35 8 (1996) 1180
12. D. Van Thourhout, G. Roelkens, J. Van Campenhout, J. Brouckaert, R. Baets, in: Proceedings of the 18th Annual Meeting of the IEEE Lasers & Electro-Optics Society, Australia, 2005, TuE2 (2 pages).
13. Shangguan D., Achyuta A., and Green W. IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B 17 4 (1994) 603
14. Bigas M., and Cabruja. Microelectronics Journal 37 (2006) 308
15. Chen Y.C., So W.W., and Lee C.C. IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A 20 1 (1997) 46
16. Matijasevic G.S., Lee C.C., and Wang C.Y. Thin Solid Films 223 (1993) 276
17. Buene L. Thin Solid Films 43 (1977) 285
18. Massalski T.B. Binary Alloy Phase Diagrams. second ed. vol. 3 (1992), ASM, Metals Park
19. Ramirez A.G., Mavoori H., and Jin S. Applied Physics Letters 80 3 (2002) 398
20. Takeuchi H., Wung A., Sun X., Howe R.T., and King T.J. IEEE Transactions on Electron Devices 52 9 (2005) 2081
21. Sedky S., Witrouw A., Bender H., and Baert K. IEEE Transactions on Electron Devices 48 4 (2001) 377
22. Department of Defence, United States of America, Test Method Standard Microcircuits, (2006), MIL-STD-883G, METHOD 2019.7, Die Shear Strength, pp. 1-6.
23. Sasaki J., Itoh M., Tamanuki T., Hatakeyama H., Kitamura S., Shimoda T., and Kato T. IEEE Transactions on Advanced Packaging 24 4 (2001) 569
24. A. He, B. Djurfors, S. Akhlaghi, D.G. Ivey, Pulse-Plating of Gold-Tin Alloys for Microelectronic and Optoelectronic Applications. .
25. J.G. Bai, TMI Thrust Teleconference, Virginia Tech., CPES, 2005.