On-demand multi-batch self-assembly of hybrid MEMS by patterning solders of different melting points

Journal of Micromechanics and Microengineering

Volumn 17, Issue 11, 2007, Pages 2163-2168

  Liu, Mei ^a   Lau, W M ^a   Yang, Jun ^a  

^a UNIVERSITY OF WESTERN ONTARIO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

BINDING SITES; MELTING POINT; SELF ASSEMBLY; SOLDERING ALLOYS;

ADEQUATE TEMPERATURES; HYBRID SYSTEMS; PATTERNING SOLDERS;

MEMS;

EID: 35648948458     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/11/001     Document Type: Article

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