Wafer-level integration of niti shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2011, Pages 348-351

  Fischer, A C ^a   Gradin, H ^a   Braun, S ^a   Schroder S ^a   Stemme, G ^a   Niklaus, F ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE DEVIATION; MECHANICAL CLAMPING; NITI SHAPE MEMORY ALLOYS; SILICON STRUCTURES; SILICON-BASED MEMS; SMA WIRE; WAFER-LEVEL INTEGRATION; WIRE BONDING TECHNOLOGY; WIREBONDER;

BONDING; MECHANICAL ENGINEERING; MECHANICS; MEMS; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; WAFER BONDING;

WIRE;

EID: 79953794837     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2011.5734433     Document Type: Conference Paper

References (11)

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