Three-dimensional integration of heterogeneous silicon micro-structures by liftoff and stamping transfer

Journal of Micromechanics and Microengineering

Volumn 17, Issue 9, 2007, Pages 1818-1827

  Onoe, Hiroaki ^a   Iwase, Eiji ^a   Matsumoto, Kiyoshi ^a   Shimoyama, Isao ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; FORMING; INTEGRATION; MEMS; MICROCHANNELS; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; NONMETALS; SILICON; SILICONES; STAMPING; SUBSTRATES; THREE DIMENSIONAL;

SILICON MICROSTRUCTURES; SINGLE SILICON SUBSTRATE; TWO-DIMENSIONAL ARRAYS;

SILICON WAFERS;

EID: 50149115178     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/9/010     Document Type: Conference Paper

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