Unit processes for Cu/BCB redistribution layer bonding for 3D ICs

Advanced Metallization Conference (AMC)

Volumn , Issue , 2006, Pages 179-183

  McMahon, J J ^a   Kumar, R J ^a,b   Niklaus, F ^a,c   Lee, S H ^a   Yu, J ^a   Lu, J Q ^a   Gutmann, R J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b INTEL CORPORATION   (United States)

^c ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; ELECTRIC POWER SYSTEM INTERCONNECTION; SILICON WAFERS; ADHESION; COPPER; ELECTRIC PROPERTIES; ELECTRIC RESISTANCE; INTEGRATED CIRCUITS;

ADHESION ENERGY; CONTACT RESISTANCE; SURFACE DAMAGE; WAFER BONDING; BACK-END-OF-THE-LINE (BEOL); BENZOCYCLOBUTENE (BCB); SEAMLESS BONDING;

MONOLITHIC INTEGRATED CIRCUITS; WSI CIRCUITS;

EID: 33644939035     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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