Gold metallizations for eutectic bonding of silicon wafers

Microsystem Technologies

Volumn 12, Issue 10-11, 2006, Pages 1021-1025

  Lani, S ^a   Bosseboeuf, A ^a   Belier, B ^a   Clerc, C ^b   Gousset, C ^a   Aubert, J ^a  

^a UNIV PARIS SUD   (France)

^b CENTRE DE CALCUL DE L INSTITUT NATIONAL DE PHYSIQUE NUCLEAIRE ET DE PHYSIQUE DES PARTICULES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; EUTECTICS; EVAPORATION; GOLD; METALLIZING; MICROELECTROMECHANICAL DEVICES; MULTILAYERS; VACUUM;

EUTECTIC BONDING; GOLD METALLIZATIONS; VACUUM PACKAGING;

SILICON WAFERS;

EID: 33747618224     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0228-6     Document Type: Conference Paper

References (6)

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