Low-cost uncooled microbolometers for thermal imaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7726, Issue , 2010, Pages

  Roxhed, Niclas ^a   Niklaus, Frank ^a   Fischer, Andreas C ^a   Forsberg, Fredrik ^a   Höglund, Linda ^b   Ericsson, Per ^b   Samel, Björn ^b   Wissmar, Stanley ^b   Elfving, Anders ^c   Simonsen, Tor Ivar ^c   Wang, Kaiying ^d   Hoivik, Nils ^d  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b ACREO AB   (Sweden)

^c SensoNor AS   (Norway)

^d UNIVERSITY OF SOUTH EASTERN NORWAY   (Norway)

Author keywords

3D integration; Automotive; Bolometer; Infrared; IR sensor; MEMS; Packaging; SiGe

Indexed keywords

3-D MEMS; 3D-INTEGRATION; ADHESIVE WAFER BONDING; BOLOMETER ARRAY; BONDING PARAMETERS; CMOS WAFERS; CONCENTRATION OF; COST-EFFICIENT; CRYSTALLINE NATURE; DRY ETCH PROCESS; ELECTRICAL PROPERTY; FEATURE SIZES; FRAME DESIGN; FULLY COMPATIBLE; HERMETICITY; HIGH TEMPERATURE PROCESS; INFRARED; INTEGRATION PROCESS; INTEGRATION TECHNOLOGIES; IR SENSOR; LOW SIGNAL-TO-NOISE RATIO; MEMS PACKAGING; MEMSDEVICES; METAL LAYER; METAL PHASIS; METALLIC BONDING; MULTILAYER STRUCTURES; OPTIMIZED PROCESS; OVERALL COSTS; PACKAGING TECHNIQUES; PIXEL RESOLUTION; POLYMER ADHESIVES; PROCESS STEPS; PRODUCT LIFETIME; SACRIFICIAL ETCHING; SI/SIGE; SINGULATION; STRAINED SIGE; SUBMICROMETERS; TECHNOLOGY PLATFORMS; TEMPERATURE COEFFICIENT OF RESISTANCE; THERMAL IMAGING; THERMALLY STABLE; THERMISTOR MATERIALS; UNCOOLED INFRARED BOLOMETERS; UNCOOLED MICROBOLOMETERS; VACUUM SEALING; VIA-HOLE; WAFER LEVEL;

BOLOMETERS; COST REDUCTION; CRYSTALLINE MATERIALS; CRYSTALLOGRAPHY; DESIGN; ELECTRIC PROPERTIES; ETCHING; FOCAL PLANE ARRAYS; GERMANIUM; INFRARED DETECTORS; INFRARED IMAGING; INTEGRATION; OPTIMIZATION; PUMPS; SENSORS; SIGNAL TO NOISE RATIO; SILICON ALLOYS; SILICON WAFERS; THERMISTORS; THREE DIMENSIONAL; TIN;

WAFER BONDING;

EID: 77953787334     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.855752     Document Type: Conference Paper

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