High-performance quantum-well silicon-germanium bolometers using IC-compatible integration for low-cost infrared imagers

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2009, Pages 2214-2217

  Forsberg, Fredrik ^a   Roxhed, Niclas ^a   Ericsson, Per ^b   Wissmar, Stanley ^b   Niklaus, Frank ^a   Stemme, Göran ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b ACREO AB   (Sweden)

Author keywords

Bolometer; Heterogeneous integration; Infrared; Quantum well; SiGe; TCR

Indexed keywords

1/F NOISE; 3-D INTEGRATION; BOLOMETER ARRAY; DEPOSITION TECHNIQUE; FAN-OUT; HETEROGENEOUS INTEGRATION; INFRARED; INFRARED IMAGERS; INTEGRATION PROCESS; METAL CONTACTS; NEGATIVE TEMPERATURE COEFFICIENT OF RESISTANCES; QUANTUM WELL; SI/SIGE; SILICON GERMANIUM; THERMISTOR MATERIALS;

ACTUATORS; BOLOMETERS; CMOS INTEGRATED CIRCUITS; ELECTRIC REACTORS; GERMANIUM; INFRARED DETECTORS; INTEGRATED CIRCUITS; LASERS; MICROSYSTEMS; PIEZOELECTRIC TRANSDUCERS; PUMPS; SEMICONDUCTING GERMANIUM COMPOUNDS; SEMICONDUCTOR QUANTUM WELLS; SILICON ALLOYS; SILICON WAFERS; THERMAL CONDUCTIVITY OF SOLIDS; THREE DIMENSIONAL;

SOLID-STATE SENSORS;

EID: 71449090160     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2009.5285617     Document Type: Conference Paper

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