A wafer-scale membrane transfer process for the fabrication of optical quality, large continuous membranes

Journal of Microelectromechanical Systems

Volumn 12, Issue 6, 2003, Pages 804-815

  Yang, Eui Hyeok ^a   Wiberg, Dean V ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adaptive optics; Continuous membrane; Deformable mirror; Electrostatic actuator; Membrane transfer; Single crystal silicon; Surface quality; Wafer scale

Indexed keywords

ADAPTIVE OPTICS; ELECTROSTATIC ACTUATORS; INTERFEROMETERS; MIRRORS; SILICON WAFERS; SINGLE CRYSTALS;

CONTINUUM MEMBRANES; DEFORMABLE MIRROR; SINGLE CRYSTAL SILICON;

MICROELECTROMECHANICAL DEVICES;

EID: 0742269327     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2003.818454     Document Type: Article

References (15)

1. R. G. Dekany, J. E. Nelson, and B. Bauman, "Design considerations for CELT adaptive optics," in Proc. SPIE International Symposium on Astronomical Telescopes and Instrumentation, vol. 4003, Munich, Germany, Mar. 27-31, 2000, pp. 212-225.
2. M. A. Ealey and J. F. Washeba, "Continuous face sheet low voltage deformable mirrors," Opt. Eng., vol. 29, pp. 1191-1198, Oct. 1990.
3. G. Vdovin, "Optimization-Based operation of micromachined deformable mirrors," in SPIE Conference on Adaptive Optical System Technology, Kona, Hawaii, 1998, pp. 902-909.
4. J. D. Mansell, P. B. Catrysse, E. K. Gustafson, and R. L. Byer, "Silicon deformable mirrors and cmos-based wavefront sensors," in Proc. SPIE Annual Meeting, vol. 4124, Aug. 1, 2000.
5. T. Bifano, R. K. Mali, J. K. Dorton, J. Perreault, N. Vandelli, M. N. Horenstein, and D. A. Castanon, "Continuous-Membrane surface-micromachined silicon deformable mirror," Opt. Eng., vol. 36 pp. 1354-1360, May 1997.
6. E. H. Yang and D. V. Wiberg, "A new wafer-level membrane transfer technique for mems deformable mirrors," in Proc. IEEE International Conference on Microelectromechanical Systems (MEMS '01) Conference, Interlaken, Switzerland, Jan. 2000, pp. 80-83.
7. H. Nguyen, P. Patterson, H. Toshiyoshi, and M. C. Wu, "A substrate-independent wafer transfer technique for surface-micromachined devices," in Proc. IEEE International Conference on Microelectromechanical Systems (MEMS '00), Sendai, Japan, 2000, pp. 628-632.
8. T. E. Bell and K. D. Wise, "A dissolved wafer process using a porous silicon sacrificial layer and a lightly-doped bulk silicon etch-stop," in Proc. IEEE International Conference on Microelectromechanical Systems (MEMS '98), Heidelberg, Germany, 1998, pp. 251-256.
9. C. G. Keller and R. T. Howe, "Hexile tweezers for teleoperated micro-assembly," in Proc. IEEE International Conference on Microelectromechanical Systems (MEMS '97), Nagoya, Japan, 1997, pp. 72-77.
10. A. Singh, D. A. Horsley, M. B. Cohn, A. P. Pisano, and R. T. Howe, "Batch transfer of microstructures using flip-chip solder bonding," J. Microelectromech. Syst., vol. 8, pp. 27-33, 1999.
11. K. F. Harsh, W. Zhang, V. M. Bright, and Y. C. Lee, "Flip-Chip assembly for Si-based RF MEMS," in Proc. IEEE International Conference on Microelectromechanical Systems (MEMS '99), Orlando, FL, 1999, pp. 273-278.
12. T. Akiyama, U. Staufer, and N. F. de Rooij, "Wafer-and piece-wise Si Tip transfer technologies for applications in scanning probe microscopy," J. Microelectromech. Syst., vol. 8, pp. 65-70, 1999.
13. F. Niklaus, P. Enoksson, P. Griss, E. Kalvesten, and G. Stemme, "Low-Temperature wafer-level transfer bonding," J. Microelectromech. Syst., vol. 10, pp. 525-531, 2001.
14. F. Niklaus, E. Kalvesten, and G. Stemme, "Wafer-Level membrane transfer bonding of polycrystalline silicon bolometers for use in infrared focal plane arrays," J. Micromech. Microeng., vol. 11, pp. 503-509, 2001.
15. G. S. Hickey, S.-S. Lih, and T. Barbee, "Development of nanolaminate thin shell mirrors," in SPIE International Symposium on Astronomical Telescopes and Instrumentation, Adaptive Optical System Technologies II, vol. 4849, Waikoloa, HI, Aug. 22-28, 2002, pp. 63-76.