3D vertical interconnects by copper direct bonding

Materials Research Society Symposium Proceedings

Volumn 1112, Issue , 2009, Pages 81-89

  Gueguen, Pierric ^a   Cioccio, Léa Di ^a   Gonchond, J P ^b   Gergaud, P ^a   Rivoire, Maurice ^b   Scevola, Daniel ^b   Zussy, Marc ^a   Lafond, Dominique ^a   Clavelier, Laurent ^a  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

3D APPLICATION; 4-POINT PROBE; AMBIENT AIR; BONDING TOUGHNESS; CONTACT SURFACE; COPPER DIRECT BONDING; KELVIN STRUCTURES; LOW-POWER CONSUMPTION; MEASUREMENT TECHNIQUES; METAL BONDING; ROOM TEMPERATURE; THROUGH SILICON VIAS; TRANSMISSION SPEED; VIA TECHNOLOGIES;

ATMOSPHERIC PRESSURE; MICROELECTRONICS; SMELTING; TECHNOLOGY;

THREE DIMENSIONAL;

EID: 70449565336     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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