Low cost, high performance far infrared microbolometer

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7726, Issue , 2010, Pages

  Rør, Audun ^a   Lapadatu, Adriana ^a   Elfving, Anders ^a   Kittilsland, Gjermund ^a   Hohler, Erling ^a  

^a Sensonor Technologies AS   (Norway)

Author keywords

3D integration; focal plane array; infrared; MEMS; microbolometer; SiGe

Indexed keywords

1/F NOISE; 3D INTEGRATION; CMOS COMPATIBLE; FAR INFRARED; FILL FACTOR; FIR SYSTEMS; HIGH THERMAL; LONG TERM; LOW COSTS; LOW TEMPERATURE WAFER BONDING; MANUFACTURING YIELD; MARKET PENETRATION; MICROBOLOMETER; MONOCRYSTALLINE SILICON; PIXEL SIZE; PROCESS INTEGRATION; READOUT INTEGRATED CIRCUITS; ROAD USERS; THERMISTOR MATERIALS; TIME TO MARKET; VACUUM SEALING; WAFER-SCALE PACKAGING;

ANIMALS; AUTOMOTIVE INDUSTRY; BOLOMETERS; CONCURRENT ENGINEERING; COST REDUCTION; ELECTRONICS PACKAGING; FIR FILTERS; FOCUSING; GERMANIUM; MOEMS; OPTIMIZATION; PUMPS; SEALING (CLOSING); SILICON ALLOYS; SILICON WAFERS; TEMPERATURE SENSORS; THERMISTORS; THREE DIMENSIONAL;

WAFER BONDING;

EID: 77953752621     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.855784     Document Type: Conference Paper

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