3D integration of heterogeneous MEMS structures by stamping transfer

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2007, Pages 175-178

  Onoe, Hiroaki ^a   Iwase, Eiji ^a   Matsumoto, Kiyoshi ^a   Shimoyama, Isao ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; FORMING; HOLOGRAMS; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROCHANNELS; MICROELECTROMECHANICAL DEVICES; NONMETALS; OPTICAL DESIGN; REACTIVE ION ETCHING; SILICON; STAMPING; THREE DIMENSIONAL; TWO DIMENSIONAL;

3-D INTEGRATION; HIGH YIELD; HIGH-ACCURACY; INTEGRATION METHODS; INTERNATIONAL CONFERENCES; MICRO-ELECTRO MECHANICAL SYSTEMS; MICRO-ELECTRO- MECHANICAL SYSTEM; POLYDIMETHYLSILOXANE PDMS; POSITION ERRORS; SILICON STRUCTURES; SINGLE WAFERS; THREE-DIMENSIONAL ASSEMBLY;

SILICON WAFERS;

EID: 50149106771     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. K. Tsui, et al., "Micromachined end-effector and techniques for directed MEMS assembly," Journal of Micromechanics and Microengineering, Vol. 14, pp.542-549, 2004.
2. K. Molhave, et al., "Pick-and-place nanomanipulation using microfabricated grippers," Nanotechnology, Vol. 17, pp.2434-2441, 2006.
3. X.R. Xiong, et al., "Controlled multibatch self-assembly of microdevices," Journal of Microelectromechanical Systems, Vol. 12, pp. 117-127, 2003.
4. H.O. Jacobs, et al., "Fabrication of a cylindrical display by patterned assembly," Science, Vol. 296, pp.323-325, 2002.
5. A. Terfort, et al., "Three-dimensional self-assembly of millimetre-scale components," Nature, Vol. 386, pp.162-164, 1997.
6. H. Onoe, et al., "Three-dimensional micro-self-assembly using hydrophobic interaction controlled by self-assembled monolayers," Journal of Microelectromechanical Systems, Vol. 13, pp.603-611, 2004.
7. M.A. Meitl, et al, "Transfer printing by kinetic control of adhesion to an elastomeric stamp," Nature Materials, Vol. 5, pp.33-38, 2006.
8. T. Kraus, et al., "Closing the gap between self-assembly and microsystems using self-assembly, transfer, and integration of particles," Advanced Materials, Vol. 17, pp.2438-2442, 2005.