Ultra-thin benzocyclobutene bonding of III-V dies onto SOI substrate

Electronics Letters

Volumn 41, Issue 9, 2005, Pages 561-562

  Roelkens, G ^a   Van Thourhout, D ^a   Baets, R ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CMOS INTEGRATED CIRCUITS; HEAT SINKS; HETEROJUNCTIONS; LITHOGRAPHY; OPTICAL WAVEGUIDES; SEMICONDUCTING INDIUM GALLIUM ARSENIDE; SILICON ON INSULATOR TECHNOLOGY; THIN FILMS;

BENZOCYCLOBUTENE (BCB); SILICON WAVEGUIDING LAYERS; SPIN-ON GLASS (SOG); ULTRA-THIN BONDING LAYERS;

DIES;

EID: 18744396938     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20050807     Document Type: Article

References (8)

1. Bogaerts, W., Wiaux, V, Beckx, S., Luyssaert, B.F.J., Bienstman, P., and Baets, R.: 'Fabrication of photonic crystals in silicon-on-insulator using 248-nm deep UV lithography', IEEE J. Sci. Top. Quantum Electron., 2002, 8, (4), pp. 928-934
2. Fukazawa, T., Sakai, A., and Baba, T.: 'H-tree-type optical clock signal distribution circuit using a Si photonic wire waveguide', Jpn. J. Appl. Phys., 2002, 41, pp. 1461-1463
3. Katnelson, A., Tokranov, V., Yakimov, M., Lamberti, M., and Oktyabrsky, S.: 'Hybrid integration of III-V opto-electronic devices on Si platform using BCB', Photonics packaging and integration III, ser. Proc. SPIE, 4997, 2003
4. Roelkens, G., Van Thourhout, D., and Baets, R.: 'Heterogeneous integration of III-V membrane devices and ultracompact SOI waveguides'. IEEE LEOS Summer Topicals, 2004, pp. 23-24
5. Miki, N., and Spearing, S.M.: 'Effect of nanoscale surface roughness on the bonding energy of direct-bonded silicon wafers', J. Appl. Phys., 2003, 94, (10), pp. 6800-6806
6. Lin, H.C., Chang, K.L., Pickrell, G.W., Hsieh, K.C., and Cheng, K.Y.: 'Low temperature wafer bonding by spin on glass', J. Vac. Sci. Technol. B, 2002, 20, (2), pp. 752-754
7. Ma, Y., Chang, G., Park, S., Wang, L., and Tiong Ho, S.: 'InGaAsP thin-film microdisk resonators fabricated by polymer wafer bonding for wavelength add-drop filters', IEEE Photonics Technol. Lett., 2000, 12, (11), pp. 1495-1497
8. Niklaus, F, Enoksson, P., Kalvesten, E., and Stemme, G.: 'Low temperature full wafer adhesive bonding', J. Micromechan. Microeng., 2001, 11, (2), pp. 100-107