Wafer-level 3D integration technology platforms for ICs and MEMS

2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005

Volumn , Issue , 2005, Pages 486-493

  Niklaus, F ^a,b   Lu, J Q ^a   McMahon, J J ^a   Yu, J ^a   Lee, S H ^a   Cale, T S ^a   Gutmann, R J ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS (ICS); INTEGRATED SENSORS; MICRO ELECTROMECHANICAL SYSTEM (MEMS); MONOCRYSTALLINE SEMICONDUCTORS; STOCKHOLM , SWEDEN; TRANSDUCER MATERIAL; WAFER-LEVEL 3D INTEGRATION; WAFER-LEVEL THREE-DIMENSIONAL (3D) INTEGRATION;

ELECTROMECHANICAL DEVICES; INTEGRATION; MEMS; SEMICONDUCTOR MATERIALS;

THREE DIMENSIONAL;

EID: 84888335511     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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