Simultaneous Cu-Cu and compliant dielectric bonding for 3D stacking of ICs

Proceedings of the IEEE 2007 International Interconnect Technology Conference - Digest of Technical Papers

Volumn , Issue , 2007, Pages 207-209

  Jourdain, A ^a   Stoukatch, S ^a   De Moor, P ^a   Ruythooren, W ^a   Pargfrieder, S ^b   Swinnen, B ^a   Beyne, E ^a  

^a IMEC   (Belgium)

^b EV GROUP   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

DENSITY (SPECIFIC GRAVITY); DIELECTRIC FILMS; ELECTRIC CONTACTS; GLUES; INTEGRATED CIRCUIT MANUFACTURE; MECHANICAL STABILITY;

COLLECTIVE BONDING; DIELECTRIC GLUE LAYERS; INTER-DIE INTERCONNECT DENSITY;

ELECTRIC POWER SYSTEM INTERCONNECTION;

EID: 34748922456     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iitc.2007.382391     Document Type: Conference Paper

References (6)

1. E. Beyne, "3D System Integration Technologies", Symposium on VLSI Technology, April 26-28, 2006, Hsinchu, Taïwan.
2. E. Beyne, "New concepts for 3D interconnects", International Interconnect Technology Conference (Short Course), June 4 2006, Burlingame, CA.
3. B. Swinnen, W. Ruythooren, P. De Moor, L. Bogaerts, L. Carbonell, K. De Munck, B. Eyckens, S. Stoukatch, D. Sabuncuoglu Tezcan, Z. Tokei, J. Vaes, J. Van Aelst and E. Beyne, "3D integration by Cu-Cu thermocompression bonding of extremely thinned bulk Si die containing 10 m pitch through Si vias", Proc. IEDM Conference, December 11-13, 2006, San Fransisco
4. www.cyclotene.com
5. A. Jourdain, P. De Moor, K. Baert, I. De Wolf, H.A.C. Tilmans, "Mechanical and Electrical Characterization of BCB as a bond and seal material for cavities housing (RF-) MEMS devices", Journal of. Micromech. Microeng., vol.15 (2005), S89-S96.
6. J.J. McMahon, J.Q. Ln and R.J. Gutmann, "Wafer Bonding of Damascene-Patterned Metal/Adhesive Redistribution Layers for via-First Three Dimensional (3D) Interconnect", Proc. ECTC Conference, 2005.