Hidden-hinge micro-mirror arrays made by heterogeneous integration of two mono-crystalline silicon layers

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2011, Pages 696-699

  Lapisa, M A ^a   Zimmer, F ^b   Gehner, A ^b   Stemme, G ^a   Niklaus, F ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE WAFER BONDING; ARRAY SIZES; CRYSTALLINE SILICONS; DOWN-SCALING; FAN-OUT; HETEROGENEOUS INTEGRATION; LARGE DEFLECTION; MATERIAL LAYERS; MICRO MIRROR; MICROMIRROR ARRAY; OPTICS APPLICATION; UPSCALING; WAFER LEVEL;

CRYSTALLINE MATERIALS; ELECTRODES; MECHANICAL ENGINEERING; MECHANICS; MEMS; MONOCRYSTALLINE SILICON; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; WAFER BONDING;

MIRRORS;

EID: 79953771546     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2011.5734520     Document Type: Conference Paper

References (7)

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