Flip-chip fabrication of advanced micromirror arrays

Sensors and Actuators, A: Physical

Volumn 95, Issue 2-3, 2002, Pages 152-167

  Adrian Michalicek, M ^a   Bright, Victor M ^a  

^a UCB 450   (United States)

Author keywords

Flip chip assembly technique; Flip chip bonding; Micromirror array

Indexed keywords

ARRAYS; FABRICATION; FLIP CHIP DEVICES; MICROMACHINING; MIRRORS; REFLECTION; SURFACE ROUGHNESS;

FLIP CHIP ASSEMBLY; FLIP CHIP BONDING; MICROMIRROR ARRAY;

MICROELECTROMECHANICAL DEVICES;

EID: 0036143270     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00726-9     Document Type: Article

References (9)

1. Development of advanced second-generation micromirror devices fabricated in a four-level, planarized surface-micromachined polycrystalline silicon process
2. Design and fabrication of optical mems using a four-level, planarized surface-micromachined polycrystalline silicon process
3. Design and characterization of next-generation micromirrors fabricated in a four-level planarized surface-micromachined polycrystalline silicon process
4. Quick prototyping of flip-chip assembly with MEMS
5. Micromirror arrays fabricated by flip-chip assembly
6. Digitally controllable variable high-Q capacitor for RF applications
7. Design, fabrication, modeling, and testing of a surface-micromachined micromirror device
8. Galvanic porous silicon formation without external contacts
9. Advanced modeling of micromirror devices