Ultra-thin chips for high-performance flexible electronics

npj Flexible Electronics

Volumn 2, Issue 1, 2018, Pages

  Gupta, Shoubhik ^a   Navaraj, William Taube ^a   Lorenzelli, Leandro ^b   Dahiya, Ravinder ^a  

^a UNIVERSITY OF GLASGOW   (United Kingdom)

^b FONDAZIONE BRUNO KESSLER   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 85053990058     PISSN: None     EISSN: 23974621     Source Type: Journal    
DOI: 10.1038/s41528-018-0021-5     Document Type: Review

References (216)

1. Martiradonna, L. Implantable devices: a solid base. Nat. Mater. 14, 962–962 (2015). DOI: 10.1038/nmat4440
2. Hu, J. Overview of flexible electronics from ITRI’s viewpoint in IEEE VTS. In 84th IEEE (Santa Cruz, USA, 2010).
3. Cheng, I. C. & Wagner, S. Overview of flexible electronics technology. In Flexible Electronics (eds Alberto Salleo & William S. Wong) 1–28 (Springer, Boston, USA, 2009).
4. Das, R. & Harrop, P. Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities 2013–2023. Cambridge: IDTechEx (2013).
5. Bandyopadhyay, D. & Sen, J. Internet of things: applications and challenges in technology and standardization. Wirel. Pers. Commun. 58, 49–69 (2011). DOI: 10.1007/s11277-011-0288-5
6. Yu, K. J., Yan, Z., Han, M. & Rogers, J. A. Inorganic semiconducting materials for flexible and stretchable electronics. npj Flex. Electron. 1, 4 (2017). DOI: 10.1038/s41528-017-0003-z
7. Park, S., Vosguerichian, M. & Bao, Z. A review of fabrication and applications of carbon nanotube film-based flexible electronics. Nanoscale 5, 1727–1752 (2013). DOI: 10.1039/c3nr33560g
8. Polat, E. O. et al. Synthesis of large area graphene for high performance in flexible optoelectronic devices. Sci. Rep. 5, 16744 (2015). DOI: 10.1038/srep16744
9. Novoselov, K. S. et al. A roadmap for graphene. Nature 490, 192–200 (2012). DOI: 10.1038/nature11458
10. Baca, A. J. et al. Semiconductor wires and ribbons for high‐performance flexible electronics. Angew. Chem. Int. Ed. 47, 5524–5542 (2008). DOI: 10.1002/anie.200703238
11. Zhou, H. et al. Fast flexible electronics with strained silicon nanomembranes. Sci. Rep. 3, 1291 (2013). DOI: 10.1038/srep01291
12. He, J., Nuzzo, R. G. & Rogers, J. A. Inorganic materials and assembly techniques for flexible and stretchable electronics. Proceed. IEEE 103, 619–632 (2015). DOI: 10.1109/JPROC.2015.2396991
13. Dahiya, R. & Gennaro, S. Bendable ultra-thin chips on flexible foils. IEEE Sens. J. 13, 4030–4037 (2013). DOI: 10.1109/JSEN.2013.2269028
14. Khan, S. et al. Flexible FETs using ultrathin Si microwires embedded in solution processed dielectric and metal layers. J. Micromech. Microeng. 25, 125019 (2015). DOI: 10.1088/0960-1317/25/12/125019
15. Sun, Y. & Rogers, J. A. Inorganic semiconductors for flexible electronics. Adv. Mater. 19, 1897–1916 (2007). DOI: 10.1002/adma.200602223
16. Khan, S., Lorenzelli, L. & Dahiya, R. Technologies for printing sensors and electronics over large flexible substrates: a review. IEEE Sens. J. 15, 3164–3185 (2015). DOI: 10.1109/JSEN.2014.2375203
17. Tok, J. B. H. & Bao, Z. Recent advances in flexible and stretchable electronics, sensors and power sources. Sci. China Chem. 55, 718–725 (2012). DOI: 10.1007/s11426-012-4503-3
18. Sekitani, T. & Someya, T. Stretchable, large‐area organic electronics. Adv. Mater. 22, 2228–2246 (2010). DOI: 10.1002/adma.200904054
19. Green, M. A. Thin-film solar cells: review of materials, technologies and commercial status. J. Mater. Sci.: Mater. Electron. 18, 15–19 (2007).
20. Rolf, B. Review of layer transfer processes for crystalline thin-film silicon solar cells. Jpn. J. Appl. Phys. 40, 4431 (2001). DOI: 10.1143/JJAP.40.4431
21. Hussain, A. M. & Hussain, M. M. CMOS‐technology‐enabled flexible and stretchable electronics for internet of everything applications. Adv. Mater. 28, 4219–4249 (2015). DOI: 10.1002/adma.201504236
22. Kim, D. H. et al. Stretchable and foldable silicon integrated circuits. Science 320, 507–511 (2008). DOI: 10.1126/science.1154367
23. Pei, Z. J., Fisher, G. R. & Liu, J. Grinding of silicon wafers: a review from historical perspectives. Int. J. Mach. Tools Manuf. 48, 1297–1307 (2008). DOI: 10.1016/j.ijmachtools.2008.05.009
24. Abgrall, P. & Gue, A. Lab-on-chip technologies: making a microfluidic network and coupling it into a complete microsystem–a review. J. Micromech. Microeng. 17, 15–49 (2007). DOI: 10.1088/0960-1317/17/5/R01
25. Crabb, R. & Treble, F. Thin silicon solar cells for large flexible arrays. Nature 213, 1223–1224 (1967). DOI: 10.1038/2131223a0
26. Lasky, J., Stiffler, S., White, F. & Abernathey, J. Silicon-on-insulator (SOI) by bonding and etch-back. In IEEE IEDM. 684–687 (IEEE, Washington DC, USA, 1985).
27. Bong, J. H. et al. A quantitative strain analysis of a flexible single-crystalline silicon membrane. Appl. Phys. Lett. 110, 033105 (2017). DOI: 10.1063/1.4974078
28. Dang, W., Vinciguerra, V., Lorenzelli, L. & Dahiya, R. Printable stretchable interconnects. Flex. Print. Electron. 2, 013003 (2017). DOI: 10.1088/2058-8585/aa5ab2
29. Wacker, N. et al. Stress analysis of ultra-thin silicon chip-on-foil electronic assembly under bending. Semicond. Sci. Technol. 29, 095007 (2014). DOI: 10.1088/0268-1242/29/9/095007
30. De Wolf, I. Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits. Semicond. Sci. Technol. 11, 139 (1996). DOI: 10.1088/0268-1242/11/2/001
31. Fedorchenko, A. I., Wang, A.-B. & Cheng, H. H. Thickness dependence of nanofilm elastic modulus. Appl. Phys. Lett. 94, 152111 (2009). DOI: 10.1063/1.3120763
32. Radhakrishnan, H. S. et al. Improving the quality of epitaxial foils produced using a poroussilicon-based layer transfer process for high-efficiency thin-film crystalline silicon solar cells. IEEE J. Photovolt. 4, 70–77 (2014). DOI: 10.1109/JPHOTOV.2013.2282740
33. Hsueh, C., Lee, S. & Chuang, T. J. An alternative method of solving multilayer bending problems. J. Appl. Mech. 70, 151–153 (2003). DOI: 10.1115/1.1526123
34. Vilouras, A., Heidari, H., Gupta, S. & Dahiya, R. Modeling of CMOS devices and circuits on flexible ultrathin chips. IEEE Trans. Electron. Devices 64, 1–9 (2017). DOI: 10.1109/TED.2017.2668899
35. Gupta, S. et al. Device modelling for bendable Piezoelectric FET-based touch sensing system. IEEE Trans. Circuits Syst. I- Reg. Pap. 63, 2200–2208 (2016). DOI: 10.1109/TCSI.2016.2615108
36. Heidari, H., Wacker, N. & Dahiya, R. Bending induced electrical response variations in ultra-thin flexible chips and device modeling. Appl. Phys. Rev. 4, 031101 (2017). DOI: 10.1063/1.4991532
37. Ju, Y. & Goodson, K. Phonon scattering in silicon films with thickness of order 100 nm. Appl. Phys. Lett. 74, 3005–3007 (1999). DOI: 10.1063/1.123994
38. Klaassen, D. B. M. A unified mobility model for device simulation—II. Temperature dependence of carrier mobility and lifetime. Solid-State Electron. 35, 961–967 (1992). DOI: 10.1016/0038-1101(92)90326-8
39. Wolpert, D. & Ampadu, P. Temperature effects in semiconductors. In Managing Temperature Effects in Nanoscale Adaptive Systems, 15–33 (Springer, New York, USA, 2012).
40. Yu, E., Wang, D., Kim, S. & Przekwas, A. Active cooling of integrated circuits and optoelectronic devices using a micro configured thermoelectric and fluidic system. In IEEE ITHERM, 134–139 (IEEE, Las Vegas, USA, 2000).
41. Hidrovo, C. H. & Goodson, K. E. Active Microfluidic Cooling of Integrated Circuits. Electrical, Optical, and Thermal Interconnections for 3D Integrated Systems (eds J. Meindl & M. Bakir) 293–330 (Boston, USA, 2008).
42. Green, M. A. & Keevers, M. J. Optical properties of intrinsic silicon at 300 K. Prog. Photo.: Res. Appl. 3, 189–192 (1995). DOI: 10.1002/pip.4670030303
43. Rojas, J. P., Sevilla, G. A. T. & Hussain, M. M. Can we build a truly high performance computer which is flexible and transparent? Sci. Rep. 3, 2609 (2013). DOI: 10.1038/srep02609
44. Green, M. A. Lambertian light trapping in textured solar cells and light‐emitting diodes: analytical solutions. Prog. Photo.: Res. Appl. 10, 235–241 (2002). DOI: 10.1002/pip.404
45. Weber, K. et al. 17% efficient thin film silicon solar cell by liquid phase epitaxy. In IEEE PSVC. 1391–1393 (IEEE, Waikoloa, USA, 1994).
46. Navaraj, W. R. T. & Kumar, A. Simulation and optimization of n-type PERL silicon solar cell structure. J. Nano- Electron. Phys. 3, 1127 (2011).
47. Navaraj, W. T., Yadav, B. K. & Kumar, A. Optoelectronic simulation and optimization of unconstrained four terminal amorphous silicon/crystalline silicon tandem solar cell. J. Comp. Electron. 15, 287–294 (2016). DOI: 10.1007/s10825-015-0767-0
48. Jerram, P. et al. Back-thinned CMOS sensor optimization in Proc. SPIE. 759813 (San Francisco, USA, 2010).
49. Dogiamis, G. C., Hosticka, B. J. & Grabmaier, A. Investigations on an ultra-thin bendable monolithic Si CMOS image sensor. IEEE Sens. J. 13, 3892–3900 (2013). DOI: 10.1109/JSEN.2013.2254474
50. Majeed, B. et al. Microstructural, mechanical, fractural and electrical characterization of thinned and singulated silicon test die. J. Micromech. Microeng. 16, 1519 (2006). DOI: 10.1088/0960-1317/16/8/012
51. Hassan, M. U. et al. Anomalous stress effects in ultra-thin silicon chips on foil. In IEEE IEDM. 1–4 (IEEE, Baltimore, USA, 2009).
52. Mizushima, Y. et al. Behavior of copper contamination on backside damage for ultra-thin silicon three dimensional stacking structure. Microelectron. Eng. 167, 23–31 (2017). DOI: 10.1016/j.mee.2016.10.010
53. Teh, W. H., Boning, D. S. & Welsch, R. E. Multi-strata stealth dicing before grinding for singulation-defects elimination and die strength enhancement: experiment and simulation. IEEE Trans. Semicond. Manufac. 28, 408–423 (2015). DOI: 10.1109/TSM.2015.2438875
54. Morcom, W. R. et al. Self-supported ultra thin silicon wafer process. US patent 6162702 A (2000).
55. Steve, R. & Robert, P. A review of focused ion beam applications in microsystem technology. J. Micromech. Microeng. 11, 287 (2001). DOI: 10.1088/0960-1317/11/4/301
56. Sevilla, G. A. T. et al. Flexible and semi‐transparent thermoelectric energy harvesters from low cost bulk silicon (100). Small 9, 3916–3921 (2013). DOI: 10.1002/smll.201301025
57. Schander, A. et al. Design and fabrication of novel multi-channel floating neural probes for intracortical chronic recording. Sens. Actuator A-Phys. 247, 125–135 (2016). DOI: 10.1016/j.sna.2016.05.034
58. Braley, C. et al. Si exfoliation by MeV proton implantation. Nucl. Instr. Meth. Phys. Res. 277, 93–97 (2012). DOI: 10.1016/j.nimb.2011.12.056
59. Shahrjerdi, D. & Bedell, S. W. Extremely flexible nanoscale ultrathin body silicon integrated circuits on plastic. Nano Lett. 13, 315–320 (2012). DOI: 10.1021/nl304310x
60. Kovacs, G. T. A., Maluf, N. I. & Petersen, K. E. Bulk micromachining of silicon. Proceed. IEEE 86, 1536–1551 (1998). DOI: 10.1109/5.704259
61. Tea, N. H. et al. Hybrid postprocessing etching for CMOS-compatible MEMS. J. Micro Syst. 6, 363–372 (1997). DOI: 10.1109/84.650134
62. Merlos, A. et al. TMAH/IPA anisotropic etching characteristics. Sens. Actuator A-Phys. 37–38, 737–743 (1993). DOI: 10.1016/0924-4247(93)80125-Z
63. Yonehara, T., Sakaguchi, K. & Sato, N. Epitaxial layer transfer by bond and etch back of porous Si. Appl. Phys. Lett. 64, 2108–2110 (1994). DOI: 10.1063/1.111698
64. Zimmermann, M. et al. A Seamless Ultra-Thin Chip Fabrication and Assembly Process. In IEEE IEDM. 1-3 (IEEE, San Francisco, USA, 2006).
65. Angelopoulos, E. & Kaiser, A. Epitaxial Growth and Selective Etching Techniques In Ultra-thin Chip Technology and Applications (ed. Joachim Burghartz), 53–60 (Springer, New York, USA, 2011).
66. Villard, P. et al. A low-voltage mixed-mode CMOS/SOI integrated circuit for 13.56 MHz RFID applications. In IEEE Inter. SOI Conf. 163–164 (IEEE, Williamsburg, USA, 2002).
67. Shahidi, G. G. SOI technology for the GHz era In Int. Symp. on VLSI-TSA. 11–14 (IEEE, Hsinchu, Taiwan, 2001).
68. Patton, G. L. New game-changing product applications enabled by SOI. In IEEE S3S. 1-1 (IEEE, Rohnert Park, USA, 2015).
69. McIntyre, H. et al. Design of the two-core x86-64 AMD “Bulldozer” module in 32 nm SOI CMOS. IEEE J. Solid-State Circuits 47, 164–176 (2012). DOI: 10.1109/JSSC.2011.2167823
70. Segovia, J. A., Fernández-Bolaños, M. & Quero, J. M. A novel suspended gate MOSFET pressure sensor. In Proc. SPIE. 363–370 (Sevilla, Spain, 2005).
71. Menard, E. et al. A printable form of silicon for high performance thin film transistors on plastic substrates. Appl. Phys. Lett. 84, 5398–5400 (2004). DOI: 10.1063/1.1767591
72. Ahn, J. H. et al. High-speed mechanically flexible single-crystal silicon thin-film transistors on plastic substrates. IEEE Electron. Device Lett. 27, 460–462 (2006). DOI: 10.1109/LED.2006.874764
73. Menard, E., Nuzzo, R. G. & Rogers, J. A. Bendable single crystal silicon thin film transistors formed by printing on plastic substrates. Appl. Phys. Lett. 86, 093507 (2005). DOI: 10.1063/1.1866637
74. Zhu, Z. T. et al. Spin on dopants for high-performance single-crystal silicon transistors on flexible plastic substrates. Appl. Phys. Lett. 86, 133507 (2005). DOI: 10.1063/1.1894611
75. Yuan, H. C., Qin, G., Celler, G. K. & Ma, Z. Bendable high-frequency microwave switches formed with single-crystal silicon nanomembranes on plastic substrates. Appl. Phys. Lett. 95, 043109 (2009). DOI: 10.1063/1.3176407
76. Sun, L. et al. Flexible high-frequency microwave inductors and capacitors integrated on a polyethylene terephthalate substrate. Appl. Phys. Lett. 96, 013509 (2010). DOI: 10.1063/1.3280040
77. Guoxuan, Q. et al. Flexible microwave PIN diodes and switches employing transferrable single-crystal Si nanomembranes on plastic substrates. J. Phys. D. Appl. Phys. 42, 234006 (2009). DOI: 10.1088/0022-3727/42/23/234006
78. Qin, G. et al. RF characterization of gigahertz flexible silicon thin-film transistor on plastic substrates under bending conditions. IEEE Electron. Device Lett. 34, 262–264 (2013). DOI: 10.1109/LED.2012.2231853
79. Yuan, H. C. & Ma, Z. Microwave thin-film transistors using Si nanomembranes on flexible polymer substrate. Appl. Phys. Lett. 89, 212105 (2006). DOI: 10.1063/1.2397038
80. Hwang, G. T. et al. In vivo silicon-based flexible radio frequency integrated circuits monolithically encapsulated with biocompatible liquid crystal polymers. ACS Nano 7, 4545–4553 (2013). DOI: 10.1021/nn401246y
81. Dekker, R. CIRCONFLEX: An Ultra-thin and flexible technology for RF-ID tags, In IEEE EMPC. 268–271 (IEEE, Brugge, Belgium, 2005).
82. Beernink, K. & Guha, S. et al. Lightweight, flexible solar cells on stainless steel foil and polymer for space and stratospheric applications, NASA/CP 214494, 54 (2007).
83. Hu, M. et al. Flexible transparent PES/silver nanowires/PET sandwich-structured film for high-efficiency electromagnetic interference shielding. Langmuir 28, 7101–7106 (2012). DOI: 10.1021/la300720y
84. Legnani, C. et al. Bacterial cellulose membrane as flexible substrate for organic light emitting devices. Thin. Solid Films 517, 1016–1020 (2008). DOI: 10.1016/j.tsf.2008.06.011
85. Moreno, S. et al. Biocompatible collagen films as substrates for flexible implantable electronics. Adv. Electron. Mater. 1, 1500154 (2015). DOI: 10.1002/aelm.201500154
86. Liu, Y. et al. Flexible organic light emitting diodes fabricated on biocompatible silk fibroin substrate. Semicond. Sci. Technol. 30, 104004 (2015). DOI: 10.1088/0268-1242/30/10/104004
87. Harman, G. Wire Bonding in Microelectronics. (McGraw Hill Professional, New York, USA, 2009).
88. Harman, G. G. & Albers, J. The ultrasonic welding mechanism as applied to aluminum-and gold-wire bonding in microelectronics. IEEE Trans. Parts, Hybrids, Packag. 13, 406–412 (1977). DOI: 10.1109/TPHP.1977.1135225
89. Banda, C. et al. Flip chip assembly of thinned silicon die on flex substrates. IEEE Trans. Electron. Packag. Manuf. 31, 1–8 (2008). DOI: 10.1109/TEPM.2007.914217
90. Kallmayer, C. et al. Reliability investigations for flip-chip on flex using different solder materials. In IEEE ECTC. 303–310 (IEEE, Las Vegas, USA, 1998).
91. Feil, M. et al. The challenge of ultra thin chip assembly. In IEEE ECTC. 35–40 (IEEE, Las Vegas, USA, 2004).
92. Van Hal, R., Eijkel, J. & Bergveld, P. A novel description of ISFET sensitivity with the buffer capacity and double-layer capacitance as key parameters. Sens. Actuator B-Chem. 24, 201–205 (1995). DOI: 10.1016/0925-4005(95)85043-0
93. Dahiya, R., Adami, A., Collini, C. & Lorenzelli, L. POSFET tactile sensing arrays using CMOS technology. Sens. Actuator A-Phys. 202, 226–232 (2013). DOI: 10.1016/j.sna.2013.02.007
94. Christiaens, W., Bosman, E. & Vanfleteren, J. UTCP: a novel polyimide-based ultra-thin chip packaging technology. IEEE Trans. Comp. Packag. Technol. 33, 754–760 (2010). DOI: 10.1109/TCAPT.2010.2060198
95. Sterken, T. et al. Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system. In IEEE EMBC. 6886–6889 (IEEE, Las Vegas, USA, 2011).
96. Hu, D. C. & Chen, H. C. Temperature and humidity effects on adhesion of polyimide film to a silicon substrate. J. Adhes. Sci. Technol. 6, 527–536 (1992). DOI: 10.1163/156856192X00377
97. Chowdhury, I. et al. On-chip cooling by superlattice-based thin-film thermoelectrics. Nat. Nanotechnol. 4, 235–238 (2009). DOI: 10.1038/nnano.2008.417
98. Ghoneim, M. T. et al. Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels. AIP Adv. 5, 127115 (2015). DOI: 10.1063/1.4938101
99. Al-Waaly, A. A., Paul, M. C. & Dobson, P. Liquid cooling of non-uniform heat flux of a chip circuit by subchannels. Appl. Therm. Eng. 115, 558–574 (2017). DOI: 10.1016/j.applthermaleng.2016.12.061
100. Bunyan, M. H. Double-side thermally conductive adhesive tape for plastic-packaged electronic components. US patent 20020012762 A1 (2002).
101. Han, N. et al. Improved heat dissipation in gallium nitride light-emitting diodes with embedded graphene oxide pattern. Nat. Commun. 4, 1452 (2013). DOI: 10.1038/ncomms2448
102. Perelaer, J., de Gans, B. J. & Schubert, U. S. Ink‐jet printing and microwave sintering of conductive silver tracks. Adv. Mater. 18, 2101–2104 (2006). DOI: 10.1002/adma.200502422
103. Dang, W., Vinciguerra, V., Lorenzelli, L. & Dahiya, R. Metal-organic dual layer structure for stretchable interconnects. Procedia Eng. 168, 1559–1562 (2016). DOI: 10.1016/j.proeng.2016.11.460
104. Califórnia, A. et al. Silver grid electrodes for faster switching ITO free electrochromic devices. Sol. Energ. Mat. Sol. Cells 153, 61–67 (2016). DOI: 10.1016/j.solmat.2016.03.012
105. Liao, C. et al. Flexible organic electronics in biology: materials and devices. Adv. Mater. 27, 7493–7527 (2015). DOI: 10.1002/adma.201402625
106. Vyas, R. et al. Inkjet printed, self powered, wireless sensors for environmental, gas, and authentication-based sensing. IEEE Sens. J. 11, 3139–3152 (2011). DOI: 10.1109/JSEN.2011.2166996
107. Yogeswaran, N. et al. New materials and advances in making electronic skin for interactive robots. Adv. Robot. 29, 1359–1373 (2015). DOI: 10.1080/01691864.2015.1095653
108. Kobayashi, N., Sasaki, M. & Nomoto, K. Stable peri-xanthenoxanthene thin-film transistors with efficient carrier injection. Chem. Mater. 21, 552–556 (2009). DOI: 10.1021/cm802826m
109. Fukuda, K. et al. Fully solution-processed flexible organic thin film transistor arrays with high mobility and exceptional uniformity. Sci. Rep. 4, 3947 (2014). DOI: 10.1038/srep03947
110. Park, S. K., Jackson, T. N., Anthony, J. E. & Mourey, D. A. High mobility solution processed 6, 13-bis (triisopropyl-silylethynyl) pentacene organic thin film transistors. Appl. Phys. Lett. 91, 3514 (2007).
111. Zschieschang, U. et al. Flexible low‐voltage organic transistors and circuits based on a high‐mobility organic semiconductor with good air stability. Adv. Mater. 22, 982–985 (2010). DOI: 10.1002/adma.200902740
112. Sekitani, T., Zschieschang, U., Klauk, H. & Someya, T. Flexible organic transistors and circuits with extreme bending stability. Nat. Mater. 9, 1015–1022 (2010). DOI: 10.1038/nmat2896
113. Castellanos, R. J. et al. Tactile sensors based on conductive polymers. Microsyst. Technol. 16, 765–776 (2010). DOI: 10.1007/s00542-009-0958-3
114. Chang, W. Y., Fang, T. H., Yeh, S. H. & Lin, Y. C. Flexible electronics sensors for tactile multi-touching. Sensors 9, 1188–1203 (2009). DOI: 10.3390/s9021188
115. Chen, H. Y. et al. Highly sensitive touch panel technology for foldable AMOLED. SID Symp. Dig. Tech. Pap. 48, 2052–2055 (2017). DOI: 10.1002/sdtp.12079
116. Núñez, C. G., Navaraj, W. T., Polat, E. O. & Dahiya, R. Energy autonomous flexible and transparent tactile skin. Adv. Funct. Mater. 27, 1606287 (2017). DOI: 10.1002/adfm.201606287
117. Hammock, M. L. et al. 25th Anniversary article: the evolution of electronic skin (E-Skin): a brief history, design considerations, and recent progress. Adv. Mater. 25, 5997–6038 (2013). DOI: 10.1002/adma.201302240
118. Dahiya, R., Metta, G., Valle, M. & Sandini, G. Tactile sensing–from humans to humanoids. IEEE Trans. Robot. 26, 1–20 (2010). DOI: 10.1109/TRO.2009.2033627
119. Dahiya, R. et al. Directions towards effective utilization of tactile skin–a review. IEEE Sens. J. 13, 4121–4138 (2013). DOI: 10.1109/JSEN.2013.2279056
120. Dahiya, R. et al. PDMS residues free transfer of micro-macrostructures on flexible substrates. Microelectron. Eng. 136, 57–62 (2015). DOI: 10.1016/j.mee.2015.04.037
121. Dahiya, R. et al. Towards tactile sensing system on chip for robotic applications. IEEE Sens. J. 11, 3216–3226 (2011). DOI: 10.1109/JSEN.2011.2159835
122. Gupta, S., Heidari, H., Lorenzelli, L. & Dahiya, R. Towards bendable piezoelectric oxide semiconductor field effect transistor based touch sensor. In IEEE ISCAS. 345–348 (IEEE, Montreal, Canada, 2016).
123. Cannata, G. et al. Modular skin for humanoid robot systems. In Int. Conf. Cognitive Syst. 1 http://www.cogsys2010.ethz.ch/doc/cogsys2010_proceedings/cogsys2010_0111.pdf (Zurich, Switzrland, 2010).
124. Dahiya, R. In Handbook of Bioelectronics: Directly Interfacing Electronics and Biological Systems (eds Sandro Carrara & Krzysztof Iniewski) (Cambridge University Press, Cambridge, UK, 2015).
125. Navaraj, W. T. et al. Nanowire FET based neural element for robotic tactile sensing skin. Front. Neurosci. 11, 501 (2017). DOI: 10.3389/fnins.2017.00501
126. Al-Rawhani, M. A. et al. Wireless capsule for autofluorescence detection in biological systems. Sens. Actuator B-Chem. 189, 203–207 (2013). DOI: 10.1016/j.snb.2013.03.037
127. Burghartz, J. et al. CMOS Imager Technologies for Biomedical Applications. In IEEE ISSCC. 142–602 (IEEE, San Francisco, USA, 2008).
128. Kunkel, G. et al. Ultra-flexible and ultra-thin embedded medical devices on large area panels. In IEEE ESTC. 1–3 (IEEE, Berlin, Germany, 2010).
129. Liu, Y., Pharr, M. & Salvatore, G. A. Lab-on-skin: a review of flexible and stretchable electronics for wearable health monitoring. ACS Nano 11, 9614–9635 (2017). DOI: 10.1021/acsnano.7b04898
130. Zhao, P. et al. Development of highly-sensitive and ultra-thin silicon stress sensor chips for wearable biomedical applications. Sens. Actuator A-Phys. 216, 158–166 (2014). DOI: 10.1016/j.sna.2014.05.018
131. Zeng, W. et al. Fiber-based wearable electronics: a review of materials, fabrication, devices, and applications. Adv. Mater. 26, 5310–5336 (2014). DOI: 10.1002/adma.201400633
132. Lauterbach, C. & Jung, S. Integrated microelectronics for smart textiles. In Ambient Intelligence (eds Werner Weber, Jan M. Rabaey & Emile Aarts), 31–47 (Springer, Berlin, Germany, 2005).
133. Veendrick, H. J. Effects of Scaling on MOS IC Design and Consequences for the Roadmap. In Nanometer CMOS ICs: From Basics to ASICs, 573–594 (Springer, Cham, Switzerland, 2017).
134. DeBenedictis, E. P. et al. Sustaining Moore’s law with 3D chips. Computer 50, 69–73 (2017). DOI: 10.1109/MC.2017.3001236
135. Courtland, R. Moore’s law’s next step: 10 nanometers. IEEE Spectr. 54, 52–53 (2017). DOI: 10.1109/MSPEC.2017.7802750
136. Ko, C. T. & Chen, K. N. Wafer-level bonding/stacking technology for 3D integration. Microelectron. Reliab. 50, 481–488 (2010). DOI: 10.1016/j.microrel.2009.09.015
137. Beyne, E. 3D system integration technologies. In IEEE VLSI-TSA. 1-9 (IEEE, Hsinchu, Taiwan, 2006).
138. Ghoneim, M. T. et al. Thin PZT‐based ferroelectric capacitors on flexible silicon for nonvolatile memory applications. Adv. Electron. Mat. 1, 1500045 (2015). DOI: 10.1002/aelm.201500045
139. Dahiya, R. & Valle, M. Robotic Tactile Sensing: Technologies and System. (Springer, 2012).
140. Tchumatchenko, T., Newman, J. P., Fong, M.-f & Potter, S. M. Delivery of continuously-varying stimuli using channelrhodopsin-2. Front. Neural Circuits 7, 184 (2013). DOI: 10.3389/fncir.2013.00184
141. Zhao, S. et al. Improved expression of halorhodopsin for light-induced silencing of neuronal activity. Brain Cell. Biol. 36, 141–154 (2008). DOI: 10.1007/s11068-008-9034-7
142. Witten, I. B. et al. Cholinergic interneurons control local circuit activity and cocaine conditioning. Science 330, 1677–1681 (2010). DOI: 10.1126/science.1193771
143. Navaraj, W. T., Yogeswaran, N., Vincenzo, V. & Dahiya, R. Simulation Study of Junctionless Silicon Nanoribbon FETs for High-Performance Printable Electronics. In IEEE ECCTD. 1–4 (IEEE, Catania, Italy, 2017).
144. McAlinden, N. et al. Thermal and optical characterization of micro-LED probes for in vivo optogenetic neural stimulation. Opt. Lett. 38, 992–994 (2013). DOI: 10.1364/OL.38.000992
145. Park, S. I. et al. Soft, stretchable, fully implantable miniaturized optoelectronic systems for wireless optogenetics. Nat. Biotechnol. 33, 1280 (2015). DOI: 10.1038/nbt.3415
146. Chortos, A., Liu, J. & Bao, Z. Pursuing prosthetic electronic skin. Nat. Mater. 15, 937–950 (2016). DOI: 10.1038/nmat4671
147. Ozioko, O., Taube, W., Hersh, M. & Dahiya, R. Smart Finger Braille: A tactile sensing and actuation based communication glove for deafblind people. In IEEE ISIE. 2014–2018 (IEEE, Edinburgh, UK, 2017).
148. Vilouras, A., Navaraj, W., Heidari, H. & Dahiya, R. Flexible Pressure Sensing System for Tongue-Based Control of Prosthetic Hands. In IEEE Sensors. (IEEE, Glasgow, UK, 2017).
149. Huo, X., Wang, J. & Ghovanloo, M. A magneto-inductive sensor based wireless tongue-computer interface. IEEE Trans. Neural Syst. Rehabil. Engg. 16, 497–504 (2008). DOI: 10.1109/TNSRE.2008.2003375
150. Tajima, R. et al. Truly wearable display comprised of a flexible battery, flexible display panel, and flexible printed circuit. J. Soc. Inf. Disp. 22, 237–244 (2014). DOI: 10.1002/jsid.242
151. Ostfeld, A. E., Gaikwad, A. M., Khan, Y. & Arias, A. C. High-performance flexible energy storage and harvesting system for wearable electronics. Sci. Rep. 6, 26122 (2016). DOI: 10.1038/srep26122
152. Pennelli, G. & Macucci, M. High-power thermoelectric generators based on nanostructured silicon. Semicond. Sci. Tech. 31, 054001 (2016). DOI: 10.1088/0268-1242/31/5/054001
153. Fattori, F., Anglani, N., Staffell, I. & Pfenninger, S. High solar photovoltaic penetration in the absence of substantial wind capacity: storage requirements and effects on capacity adequacy. Energy 15, 193–208 (2017). DOI: 10.1016/j.energy.2017.07.007
154. Green, M. A. et al. Solar cell efficiency tables (version 50). Prog. Photo.: Res. Appl. 25, 668–676 (2017). DOI: 10.1002/pip.2909
155. Bedell, S. W. et al. Layer transfer by controlled spalling. J. Phys. D. Appl. Phys. 46, 152002 (2013). DOI: 10.1088/0022-3727/46/15/152002
156. Hochbauert, T. et al. Hydrogen-implantation induced silicon surface layer exfoliation. Philos. Mag: B 80, 1921–1931 (2000). DOI: 10.1080/13642810008216514
157. Sekitani, T. et al. Stretchable active-matrix organic light-emitting diode display using printable elastic conductors. Nat. Mater. 8, 494–499 (2009). DOI: 10.1038/nmat2459
158. Cao, Q. et al. Medium-scale carbon nanotube thin-film integrated circuits on flexible plastic substrates. Nature 454, 495–500 (2008). DOI: 10.1038/nature07110
159. Saxena, T. & Bellamkonda, R. V. Implantable electronics: a sensor web for neurons. Nat. Mater. 14, 1190–1191 (2015). DOI: 10.1038/nmat4454
160. Lee, J. et al. Stretchable GaAs photovoltaics with designs that enable high areal coverage. Adv. Mater. 23, 986–991 (2011). DOI: 10.1002/adma.201003961
161. Ma, R. Q. et al. Flexible active‐matrix OLED displays: challenges and progress. J. Soc. Inf. Disp. 16, 169–175 (2008). DOI: 10.1889/1.2835025
162. Gao, W. et al. Fully integrated wearable sensor arrays for multiplexed in situ perspiration analysis. Nature 529, 509–514 (2016). DOI: 10.1038/nature16521
163. Kobayashi, Y., Plankensteiner, M. & Honda, M. Thin Wafer Handling and Processing without Carrier Substrates In Ultra-thin Chip Technology and Applications (ed Joachim Burghartz), 45–51 (Springer, New York, USA, 2011).
164. Landesberger, C., Scherbaum, S. & Bock, K. Ultra-thin Wafer Fabrication Through Dicing-by-Thinning In Ultra-thin Chip Technology and Applications (ed Joachim Burghartz), 33–43 (Springer, New York, USA, 2011).
165. 2 enabled deterministic transformation of bulk silicon (100) into flexible silicon layer. AIP Adv. 6, 075010 (2016). DOI: 10.1063/1.4959193
166. Höchbauer, T. On the mechanisms of hydrogen implantation induced silicon surface layer cleavage, PhD dissertation, (The Philipps University of Marburg, Germany, 2002).
167. Zimmermann, M., Burghartz, J., Appel, W. & Harendt, C. Fabrication of Ultra-thin Chips Using Silicon Wafers with Buried Cavities. In Ultra-thin Chip Technology and Applications (ed. Joachim Burghartz), 69–77 (Springer, New York, USA, 2011).
168. Burghartz, J. Silicon-on-Insulator (SOI) Wafer-Based Thin-Chip Fabrication. In Ultra-thin Chip Technology and Applications (ed. Joachim Burghartz), 61–67 (Springer, New York, USA, 2011).
169. Prasad, C. et al. Transistor reliability characterization and comparisons for a 14 nm tri-gate technology optimized for System-on-Chip and foundry platforms. In IEEE IRPS. 4B-5-1-4B-5-8 (IEEE, Pasadena, USA, 2016).
170. Stellari, F. et al. Self-heating measurement of 14-nm FinFET SOI transistors using 2-D time-resolved emission. IEEE Trans. Electron. Devices 63, 2016–2022 (2016). DOI: 10.1109/TED.2016.2537054
171. Hatalis, M. K. & Greve, D. W. High-performance thin-film transistors in low-temperature crystallized LPCVD amorphous silicon films. IEEE Electron. Device Lett. 8, 361–364 (1987). DOI: 10.1109/EDL.1987.26660
172. Rieutort-Louis, W. et al. Current gain of amorphous silicon thin-film transistors above the cutoff frequency. In IEEE DRC. 273–274 (IEEE, Santa Barbara, USA, 2014).
173. max of 260/220 GHz. Appl. Phys. Express 6, 016503 (2012). DOI: 10.7567/APEX.6.016503
174. Zhang, L. Q. et al. Low-temperature Ohmic contact formation in GaN high electron mobility transistors using microwave annealing. IEEE Electron. Device Lett. 36, 896–898 (2015). DOI: 10.1109/LED.2015.2461545
175. 2/Vs for use in high-κ dielectric NMOSFETs. Solid-State Electron. 50, 1175–1177 (2006). DOI: 10.1016/j.sse.2006.05.017
176. Wang, C. et al. Self-aligned, extremely high frequency III–V metal-oxide-semiconductor field-effect transistors on rigid and flexible substrates. Nano Lett. 12, 4140–4145 (2012). DOI: 10.1021/nl301699k
177. 2 transistor with low Schottky barrier contact by using atomic thick h‐BN as a tunneling layer. Adv. Mater. 28, 8302–8308 (2016). DOI: 10.1002/adma.201602757
178. 2 grains. Appl. Phys. Lett. 102, 142106 (2013). DOI: 10.1063/1.4801861
179. 2 transistors with scandium contacts. Nano Lett. 13, 100–105 (2013). DOI: 10.1021/nl303583v
180. Cheng, R. et al. Few-layer molybdenum disulfide transistors and circuits for high-speed flexible electronics. Nat. Commun. 5, 5143 (2014). DOI: 10.1038/ncomms6143
181. Liu, X. et al. High performance field-effect transistor based on multilayer tungsten disulfide. ACS Nano 8, 10396–10402 (2014). DOI: 10.1021/nn505253p
182. 2 heterostructures for flexible and transparent electronics. Nat. Nanotechnol. 8, 100–103 (2013). DOI: 10.1038/nnano.2012.224
183. Zhang, Y. et al. High mobility multibit nonvolatile memory elements based organic field effect transistors with large hysteresis. Org. Electron. 35, 53–58 (2016). DOI: 10.1016/j.orgel.2016.05.008
184. Yu, J., Yu, X., Zhang, L. & Zeng, H. Ammonia gas sensor based on pentacene organic field-effect transistor. Sens. Actuator B-Chem. 173, 133–138 (2012). DOI: 10.1016/j.snb.2012.06.060
185. Kitamura, M. & Arakawa, Y. High Frequency Operation (>10 MHz) in Pentacene Thin‐Film Transistors. In AIP Conf. Proc. 883–884 (Seoul, Korea, 2011).
186. Meric, I. et al. Channel length scaling in graphene field-effect transistors studied with pulsed current− voltage measurements. Nano Lett. 11, 1093–1097 (2011). DOI: 10.1021/nl103993z
187. Wang, L. et al. One-dimensional electrical contact to a two-dimensional material. Science 342, 614–617 (2013). DOI: 10.1126/science.1244358
188. Lin, Y. M. et al. 100-GHz transistors from wafer-scale epitaxial graphene. Science 327, 662–662 (2010). DOI: 10.1126/science.1184289
189. Sevilla, G. A. T. et al. High performance high-κ/metal gate complementary metal oxide semiconductor circuit element on flexible silicon. Appl. Phys. Lett. 108, 94–102 (2016).
190. Richter, H. et al. Technology and design aspects of ultra-thin silicon chips for bendable electronics. In IEEE ICICDT. 149–154 (IEEE, Austin, USA, 2009).
191. Jiun, H. H., Ahmad, I., Jalar, A. & Omar, G. Effect of wafer thinning methods towards fracture strength and topography of silicon die. Microelectron. Reliab. 46, 836–845 (2006). DOI: 10.1016/j.microrel.2005.07.110
192. Maeda, N. et al. Development of sub 10-µm ultra-thinning technology using device wafers for 3D manufacturing of terabit memory. In IEEE VLSIT. 105–106 (IEEE, Honolulu, USA, 2010).
193. Shinsho, K. et al. Evaluation of monolithic silicon-on-insulator pixel devices thinned to 100 μm. In IEEE NSS/MIC 646–649 (IEEE, Knoxville, USA, 2010).
194. Takyu, S., Sagara, J. & Kurosawa, T. A study on chip thinning process for ultra thin memory devices. In IEEE ECTC. 1511–1516 (IEEE, Lake Buena Vista, USA, 2008).
195. Yoo, H. Dicing before grinding process for preparation of semiconductor. US patent 20120040510 A1 (2012).
196. 2 plasma. Microelectron. Eng. 110, 311–314 (2013). DOI: 10.1016/j.mee.2013.02.034
197. Sivaram, S., Agarwal, A., Herner, S. B. & Petti, C. J. Method to form a photovoltaic cell comprising a thin lamina. (2010).
198. Shahrjerdi, D. et al. High-efficiency thin-film InGaP/InGaAs/Ge tandem solar cells enabled by controlled spalling technology. Appl. Phys. Lett. 100, 053901 (2012). DOI: 10.1063/1.3681397
199. Wang, S. et al. Large-area free-standing ultrathin single-crystal silicon as processable materials. Nano Lett. 13, 4393–4398 (2013). DOI: 10.1021/nl402230v
200. Burghartz, J., Appel, W., Rempp, H. D. & Zimmermann, M. A new fabrication and assembly process for ultrathin chips. IEEE Trans. Electron. Devices 56, 321–327 (2009). DOI: 10.1109/TED.2009.2010581
201. Dekker, R. et al. A 10 µm thick RF-ID tag for chip-in-paper applications. In IEEE BCTM. 18–21 (IEEE, Santa Barbara, USA, 2005).
202. Yun, D. J., Lim, S. H., Lee, T. W. & Rhee, S. W. Fabrication of the flexible pentacene thin-film transistors on 304 and 430 stainless steel (SS) substrate. Org. Electron. 10, 970–977 (2009). DOI: 10.1016/j.orgel.2009.05.005
203. Seth, A. et al. Growth and characterization of CdTe by close spaced sublimation on metal substrates. Sol. Energy Mater. Sol. Cells 59, 35–49 (1999). DOI: 10.1016/S0927-0248(99)00029-X
204. Kolahchi, A. R., Ajji, A. & Carreau, P. J. Improvement of PET surface hydrophilicity and roughness through blending In AIP Conf. Proceed. (ed. Sadhan C. Jana) 030001 (AIP Publishing, Cleveland, Ohio, USA, 2015).
205. Wohl, C. J., Belcher, M. A., Ghose, S. & Connell, J. W. Modification of the surface properties of polyimide films using polyhedral oligomeric silsesquioxane deposition and oxygen plasma exposure. Appl. Surf. Sci. 255, 8135–8144 (2009). DOI: 10.1016/j.apsusc.2009.05.030
206. Johnston, I., McCluskey, D., Tan, C. & Tracey, M. Mechanical characterization of bulk Sylgard 184 for microfluidics and microengineering. J. Micromech. Microeng. 24, 035017 (2014). DOI: 10.1088/0960-1317/24/3/035017
207. Tang, J. et al. Highly stretchable electrodes on wrinkled polydimethylsiloxane substrates. Sci. Rep. 5, 16527 (2015). DOI: 10.1038/srep16527
208. Achyuthan, K. et al. Parylene C Aging Studies. 1–42 (Sandia National Laboratories, Albuquerque, NM (USA, 2014).
209. Chang, T. Y. et al. Cell and protein compatibility of parylene-C surfaces. Langmuir 23, 11718–11725 (2007). DOI: 10.1021/la7017049
210. 22 thin films on polyethylene naphthalate organic substrates. IEEE Trans. Magn. 46, 1356–1359 (2010). DOI: 10.1109/TMAG.2010.2045346
211. Starosta, W., Wawszczak, D. & Buczkowski, M. PEN as a material for particle track membranes. 98–99 (IAEA, Warsaw, Poland, 1998).
212. Wenger, M. P., Bozec, L., Horton, M. A. & Mesquida, P. Mechanical properties of collagen fibrils. Biophys. J. 93, 1255–1263 (2007). DOI: 10.1529/biophysj.106.103192
213. Jiang, C. et al. Mechanical properties of robust ultrathin silk fibroin films. Adv. Funct. Mater. 17, 2229–2237 (2007). DOI: 10.1002/adfm.200601136
214. Baimark, Y., Srisa-ard, M. & Srihanam, P. Morphology and thermal stability of silk fibroin/starch blended microparticles. Express Polym. Lett. 4, 781–789 (2010). DOI: 10.3144/expresspolymlett.2010.94
215. Elahi, M. F., Guan, G., Wang, L. & King, M. W. Influence of layer-by-layer polyelectrolyte deposition and EDC/NHS activated heparin immobilization onto silk fibroin fabric. Materials 7, 2956–2977 (2014). DOI: 10.3390/ma7042956
216. Saravanan, D. Spider silk-structure, properties and spinning. J. Text. Appar. Technol. Manag. 5, 1–20 (2006).