Thin wafer handling and processing without carrier substrates

Ultra-thin Chip Technology and Applications

Volumn , Issue , 2011, Pages 45-51

  Kobayashi, Yoshikazu ^a   Plankensteiner, Martin ^a   Honda, Midoriko ^a  

^a Sales Engineering Division Marketing Group   (Japan)

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EID: 84892051570     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-7276-7_5     Document Type: Chapter

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