Bendable ultra-thin chips on flexible foils

IEEE Sensors Journal

Volumn 13, Issue 10, 2013, Pages 4030-4037

  Dahiya, Ravinder S ^a,b   Gennaro, Salvatore ^b  

^a UNIVERSITY OF GLASGOW   (United Kingdom)

^b FONDAZIONE BRUNO KESSLER   (Italy)

Author keywords

bendable system; bending mechanics; Flex Chip; flexible electronics; transfer printing

Indexed keywords

BENDABLE SYSTEM; BENDING MECHANICS; COST-EFFECTIVE FABRICATION; FLEX-CHIP; FLEXIBLE SUBSTRATE; METAL INTERCONNECTS; RADIUS OF CURVATURE; TRANSFER PRINTING;

COST EFFECTIVENESS; FLEXIBLE ELECTRONICS; PRINTING; SILICON;

SILICON WAFERS;

EID: 84884149565     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2013.2269028     Document Type: Article

References (39)

1. A. Nathan, A. Ahnood, M. T. Cole, L. Sungsik, Y. Suzuki, P. Hiralal, F. Bonaccorso, T. Hasan, L. Garcia-Gancedo, A. Dyadyusha, S. Haque, P. Andrew, S. Hofmann, J. Moultrie, C. Daping, A. J. Flewitt, A. C. Ferrari, M. J. Kelly, J. Robertson, G. A. J. Amaratunga, and W. I. Milne, "Flexible electronics: The next ubiquitous platform," Proc. IEEE, vol. 100, no. 13, pp. 1486-1517, Jun. 2012.
2. D. Tobjörk and R. Österbacka, "Paper electronics," Adv. Mater., vol. 23, pp. 1935-1961, Feb. 2011.
3. V. L. Lumelsky, M. S. Shur, and S. Wagner, "Sensitive skin," IEEE Sensors J., vol. 1, no. 1, pp. 41-51, Apr. 2001.
4. Q. Qing, S. K. Pal, B. Tian, X. Duan, B. P. Timko, T. Cohen-Karni, V. N. Murthy, and C. M. Lieber, "Nanowire transistor arrays for mapping neural circuits in acute brain slices," Proc. Nat. Acad. Sci., vol. 107, no. 5, pp. 1882-1887, 2010.
5. R. S. Dahiya, P. Mittendorfer, M. Valle, G. Cheng, and V. Lumelsky "Directions towards effective utilization of tactile skin-A review," IEEE Sensor J., vol. 20, pp. 1-18, 2013, to be published.
6. R. S. Dahiya and M. Valle, Robotic Tactile Sensing-Technologies and System. New York, NY, USA: Springer-Verlag, 2013, pp. 1-245.
7. R. S. Dahiya, G. Metta, M. Valle, and G. Sandini, "Tactile sensing-From humans to humanoids," IEEE Trans. Robot., vol. 26, no. 1, pp. 1-20, Feb. 2010.
8. P. Mittendorfer and G. Cheng, "Humanoid multimodal tactile-sensing modules," IEEE Trans. Robot., vol. 27, no. 3, pp. 401-410, Jun. 2011.
9. G. Cannata, R. S. Dahiya, M. Maggiali, F. Mastrogiovanni, G. Metta, and M. Valle, "Modular skin for humanoid robot systems," in Proc. 4th Int. Conf. CogSys 2010, Jan., p. 1.
10. Y. Ohmura and Y. Kuniyoshi, "Humanoid robot which can lift a 30 kg box by whole body contact and tactile feedback," in Proc. IEEE/RSJ Int. Conf. IROS 2007, San Diego, CA, USA, Oct./Nov., pp. 1136-1141.
11. E. Cheung and V. L. Lumelsky, "A sensitive skin system for motion control of robot arm manipulators," J. Robot. Auton. Syst., vol. 10, no. 1, pp. 9-32, 1992.
12. S. C. B. Mannsfeld, B. C. K. Tee, R. M. Stoltenberg, C. V. H. H. Chen, S. Barman, B. V. O. Muir, A. N. Sokolov, C. Reese, and Z. Bao, "Highly sensitive flexible pressure sensors with microstructured rubber dielectric layers," Nature Mater., vol. 9, pp. 859-864, Sep. 2010.
13. T. Sekitani and T. Someya, "Stretchable, large-area organic electronics," Adv. Mater., vol. 22, no. 20, pp. 2228-2246, 2010.
14. S. Madhusudan, M. H. Hanna, D. Parul, and E. J. Ghassan, "Inkjet printing-Process and its applications," Adv. Mater., vol. 22, no. 6, pp. 673-685, 2010.
15. J. H. Cho, J. Lee, Y. Xia, B. Kim, Y. He, M. J. Renn, Y. He, T. P. Lodge, and F. C. Daniel, "Printable ion-gel gate dielectrics for low-voltage polymer thin-film transistors on plastic," Nature Mater., vol. 7, pp. 900-906, Oct. 2008.
16. R. A. Street, "Thin-film transistors," Adv. Mater., vol. 21, no. 20, pp. 2007-2022, 2009.
17. R. S. Dahiya, A. Adami, C. Collini, and L. Lorenzelli, "Fabrication of single crystal silicon mirco-/nanostructures and transferring them to flexible substrates," Microelectron. Eng., vol. 98, pp. 502-507, Oct. 2012.
18. D.-H. Kim, J.-H. Ahn, W. M. Choi, H.-S. Kim, T.-H. Kim, J. Song, Y. Y. Huang, Z. Liu, C. Lu, and J. A. Rogers, "Stretchable and foldable silicon integrated circuits," Science, vol. 320, pp. 507-511, Mar. 2008.
19. K. J. Lee, M. J. Motala, M. A. Meitl, W. R. Childs, E. Menard, A. K. Shim, J. A. Rogers, and R. G. Nuzzo, "Large-area, selective transfer of microstructured silicon: A printing-based approach to highperformance thin-film transistors supported on flexible substrates," Adv. Mater., vol. 17, no. 19, pp. 2332-2336, 2005.
20. K.-Q. Peng and S.-T. Lee, "Silicon nanowires for photovoltaic solar energy conversion," Adv. Mater., vol. 23, no. 2, pp. 198-215, 2011.
21. D.-H. Kim, N. Lu, R. Ma, Y.-S. Kim, R.-H. Kim, S. Wang, J. Wu, S. M. Won, H. Tao, A. Islam, K. J. Yu, T.-I. Kim, R. Chowdhury, M. Ying, L. Xu, M. Li, H.-J. Chung, H. Keum, M. McCormick, P. Liu, Y.-W. Zhang, F. G. Omenetto, Y. Huang, T. Coleman, and J. A. Rogers, "Epidermal electronics," Science, vol. 333, pp. 838-843, Aug. 2011.
22. W. Christiaens, E. Bosman, and J. Vanfleteren, "UTCP: A novel polyimide-based ultra-thin chip packaging technology," IEEE Trans. Compon. Packag. Technol., vol. 33, no. 4, pp. 754-760, Dec. 2010.
23. H. Rempp, J. Burghartz, C. Harendt, N. Pricopi, M. Pritschow, C. Reuter, H. Richter, I. Schindler, and M. Zimmermann, "Ultra-thin chips on foil for flexible electronics," in Proc. IEEE ISSCC 2008, Feb., pp. 18.3.1-18.3.3.
24. R. S. Dahiya, A. Adami, C. Collini, and L. Lorenzelli, "Bendable ultra-thin silicon chips on foil," in Proc. IEEE Sensors 2012, Oct., pp. 231-234.
25. N. McLellan, N. Fan, S. Liu, K. Lau, and J. Wu, "Effects of wafer thinning condition on the roughness, morphology and fracture strength of silicon die," J. Electron. Packag., vol. 126, no. 1, pp. 110-114, 2004.
26. F. Schmitt and M. Zernack, "Thin wafer manufacturing and handling using low cost carriers," in Ultra-Thin Chip Technology and Applications, J. Burghartz, Ed. New York, NY, USA: Springer-Verlag, 2011, pp. 21-32.
27. R. Dekker, K. Dessein, J.-H. Fock, A. Gakis, C. Jonville, O. M. Kuijken, T. M. Michielsen, P. Mijlemans, H. Pohlmann, W. Schnitt, C. E. Timmering, and A. M. H. Tombeur, "Substrate transfer: Enabling technology for RF applications," in Proc. IEEE IEDM 2003, Dec., pp. 15.4.1-15.4.4.
28. G. T. A. Kovacs, N. I. Maluf, and K. E. Petersen, "Bulk micromachining of silicon," Proc. IEEE, vol. 86, no. 8, pp. 1536-1551, Aug. 1998.
29. M. Motoyoshi, "Through-silicon via (TSV)," Proc. IEEE, vol. 97, no. 1, pp. 43-48, Jan. 2009.
30. R. S. Dahiya, L. Lorenzelli, "Removing cured PDMS from micro/nanostructures," in Proc. 38th Int. Conf. MNE 2012, pp. 1-2.
31. S. Takayama, E. Ostuni, X. Qian, J. C. McDonald, X. Jiang, P. LeDuc, M. H. Wu, D. E. Ingber, and G. M. Whitesides, "Topographical micropatterning of poly(dimethylsiloxane) using laminar flows of liquids in capillaries," Adv. Mater., vol. 13, no. 8, pp. 570-574, 2001.
32. I.-C. Cheng and S. Wagner, "Overview of flexible electronics technology," in Flexible Electronics-Materials and Applications, W. S. Wong and A. Salleo Eds. New York, NY, USA: Springer-Verlag, 2009, pp. 1-20.
33. R. S. Dahiya, G. Metta, M. Valle, A. Adami, and L. Lorenzelli, "Piezoelectric oxide semiconductor field effect transistor touch sensing devices," Appl. Phys. Lett., vol. 95, no. 3, pp. 034105-1-034105-3, 2009.
34. R. S. Dahiya, L. Lorenzelli, G. Metta, and M. Valle, "POSFET devices based tactile sensing arrays," in Proc. IEEE ISCAS 2010, May/Jun., pp. 893-896.
35. R. S. Dahiya, D. Cattin, A. Adami, C. Collini, L. Barboni, M. Valle, L. Lorenzelli, R. Oboe, G. Metta, and F. Brunetti, "Towards tactile sensing system on chip for robotic applications," IEEE Sensors J., vol. 11, no. 12, pp. 3216-3226, Dec. 2011.
36. A. Adami, R. S. Dahiya, C. Collini, D. Cattin, and L. Lorenzelli, "POSFET touch sensor with CMOS integrated signal conditioning electronics," Sens. Actuators A, Phys., vol. 188, pp. 75-81, Dec. 2012.
37. Z. Suo, E. Y. Ma, H. Gleskova, and S. Wagner, "Mechanics of rollable and foldable film-on-foil electronics," Appl. Phys. Lett., vol. 74, no. 8, pp. 1177-1179, 1999.
38. C.-H. Hsueh, "Modeling of elastic deformation of multilayers due to residual stresses and external bending," J. Appl. Phys., vol. 91, no. 12, pp. 9652-9656, 2002.
39. A. J. Baca, J.-H. Ahn, Y. Sun, M. A. Meitl, E. Menard, H.-S. Kim, W. M. Choi, D.-H. Kim, Y. Huang, and J. A. Rogers, "Semiconductor wires and ribbons for high-performance flexible electronics," Angew. Chem. Int. Ed., vol. 47, no. 30, pp. 5524-5542, 2008.