Investigations on an ultra-thin bendable monolithic si CMOS image sensor

IEEE Sensors Journal

Volumn 13, Issue 10, 2013, Pages 3892-3900

  Dogiamis, Georgios C ^a   Hosticka, Bedrich J ^a   Grabmaier, Anton ^a  

^a UNIVERSITY OF DUISBURG ESSEN   (Germany)

Author keywords

Flexible CMOS image sensor; mechanical stress; photodiodes

Indexed keywords

CMOS ACTIVE PIXEL SENSORS; CMOS IMAGE SENSOR; CORRELATED DOUBLE SAMPLING; ELECTRICAL CHARACTERISTIC; ENCAPSULATION PROCESS; MECHANICAL STRESS; STRESS INDEPENDENTS; UNI-AXIAL MECHANICAL STRESS;

DIGITAL CAMERAS; PHOTODIODES;

STRESSES;

EID: 84883753239     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2013.2254474     Document Type: Article

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