Effect of wafer thinning methods towards fracture strength and topography of silicon die

Microelectronics Reliability

Volumn 46, Issue 5-6, 2006, Pages 836-845

  Jiun, Hoh Huey ^a   Ahmad, Ibrahim ^a   Jalar, Azman ^a   Omar, Ghazali ^b  

^a UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

^b ON Semiconductor SCG Industries M Sdn Bhd Malaysia   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; FRACTURE TOUGHNESS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SURFACE ROUGHNESS;

CHEMICAL WET ETCH; SILICON DIE; TOPOGRAPHY;

DYES;

EID: 33645225964     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.110     Document Type: Conference Paper

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