CIRCONFLEX: An ultra-thin and flexible technology for RF-ID tags

15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings

Volumn , Issue , 2005, Pages 268-271

  Dekker, R ^a   Dumling M ^b   Fock, J H ^c   Gourhant, O ^d   Jonville, C ^d   Kubrin, R ^b   Michielsen, T M ^a   Pohlmann, H ^c   Schnitt, W ^c   Tombeur, A M H ^a   Zoumpoulidis, T ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

^c PHILIPS RESEARCH LABORATORIES   (Germany)

^d Grenoble INP Phelma   (France)

Author keywords

Chip in paper; Flexible circuits; RF ID tags; Substrate transfer technology

Indexed keywords

CHIP SCALE PACKAGES; MICROELECTRONICS; SILICON WAFERS;

CHIP THICKNESS; CIRCONFLEX TECHNOLOGY; CONTACT LESS; FLEXIBLE CIRCUIT; FLEXIBLE TECHNOLOGIES; RF-ID TAGS; SUBSTRATE TRANSFER TECHNOLOGIES; WORKING DISTANCES;

FLEXIBLE ELECTRONICS;

EID: 77950966897     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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