Stress analysis of ultra-thin silicon chip-onfoil electronic assembly under bending

Semiconductor Science and Technology

Volumn 29, Issue 9, 2014, Pages

  Wacker, Nicoleta ^a   Richter, Harald ^a   Hoang, Tu ^a   Gazdzicki, Pawel ^b   Schulze, Mathias ^b   Angelopoulos, Evangelos A ^a   Hassan, Mahadi Ul ^a   Burghartz, Joachim N ^a  

^a Institut fur Mikroelektronik Stuttgart   (Germany)

^b GERMAN AEROSPACE CENTER DLR   (Germany)

Author keywords

flexible electronics; piezoresistivity; Raman spectroscopy; strained silicon; ultra thin chip

Indexed keywords

FLEXIBLE ELECTRONICS; RAMAN SPECTROSCOPY; RELIABILITY ANALYSIS; STRESS ANALYSIS;

COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; ELECTRONIC ASSEMBLIES; MICRO RAMAN SPECTROSCOPY; PIEZO-RESISTIVE BEHAVIOR; PIEZORESISTIVITY; SINGLE CRYSTAL SILICON; STRAINED SILICON; ULTRA-THIN CHIPS;

SILICON;

EID: 84906657155     PISSN: 02681242     EISSN: 13616641     Source Type: Journal    
DOI: 10.1088/0268-1242/29/9/095007     Document Type: Article

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