Microstructural, mechanical, fractural and electrical characterization of thinned and singulated silicon test die

Journal of Micromechanics and Microengineering

Volumn 16, Issue 8, 2006, Pages 1519-1529

  Majeed, Bivragh ^a   Paul, Indrajit ^a   Razeeb, Kafil M ^a   Barton, John ^a   O'Mathuna, Sean C ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; FRACTURE TOUGHNESS; LASERS; MECHANICAL PROPERTIES; MICROSTRUCTURE; SILICON; THICKNESS CONTROL;

DICING SAW; DIE THICKNESS; FRACTURE LOAD; SILICON TEST DIE;

DIES;

EID: 33746288649     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/8/012     Document Type: Article

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