Hybrid postprocessing etching for CMOS-compatible MEMS

Journal of Microelectromechanical Systems

Volumn 6, Issue 4, 1997, Pages 363-372

  Tea, Nim H ^a,b,e   Milanović, Veljko ^b,f,g,h,m   Zincke, Christian A ^c,f,g,m   Suehle, John S ^b,g,i,j,k   Gaitan, Michael ^b,i,k,m   Zaghloul, Mona E ^b,c,f,l,m,n   Geist, Jon ^{b,d,f,k,o,p,q,r}  

^a GE MEDICAL SYSTEMS   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^c George Washington University   (United States)

^d Optical ETC   (United States)

^e UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^f GEORGE WASHINGTON UNIVERSITY   (United States)

^g NATIONAL INSTITUTE OF STANDARDS   (United States)

^h RF Microsystems   (United States)

ⁱ UNIVERSITY OF MARYLAND   (United States)

^j EIA JEDEC 142 Standards Committe

^k National Institute of Standards ^*

^l UNIVERSITY OF WATERLOO   (Canada)

^m IEEE   (United States)

ⁿ Tech Comm VLSI Syst and Applic

^o UNIVERSITY OF ALBERTA   (Canada)

^p NBS Semiconduct Electronics Div

^q NBS Image Recog Grp Optical C

^r Optical ETC Inc   (United States)

more..

Author keywords

CMOS microwave elements; Isotropic and anisotropic silicon etching; Maskless etching; Microelectromechanical systems (MEMS); Micromachining; Suspended transmission lines

Indexed keywords

CMOS INTEGRATED CIRCUITS; ETCHING; FABRICATION; MICROELECTRONIC PROCESSING; MICROWAVE INTEGRATED CIRCUITS; SILICON WAFERS; TRANSMISSION LINE THEORY; WAVEGUIDES;

ETHYLENEDIAMINE PYROCATECHNOL; GAS PHASE XENON DIFLUORIDE; HYBRID POSTPROCESSING ETCHING; MICROELECTROMECHANICAL SYSTEMS; TETRAMETHYLAMMONIUM HYDROXIDE;

MICROELECTROMECHANICAL DEVICES;

EID: 0031375239     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.650134     Document Type: Article

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