Stretchable and foldable silicon integrated circuits

Science

Volumn 320, Issue 5875, 2008, Pages 507-511

  Kim, Dae Hyeong ^a   Ahn, Jong Hyun ^b   Won, Mook Choi ^a   Kim, Hoon Sik ^a   Kim, Tae Ho ^a   Song, Jizhou ^c   Huang, Yonggang Y ^d   Liu, Zhuangjian ^e   Lu, Chun ^e   Rogers, John A ^a,c  

^a United States of America   (United States)

^b Sungkyunkwan University   (South Korea)

^c UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^d NORTHWESTERN UNIVERSITY   (United States)

^e INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIMETICONE; ELASTOMER; NANORIBBON; PLASTIC; SILICON;

ELECTRICAL PROPERTY; ELECTRONIC EQUIPMENT; INSTALLATION; MECHANICS; SILICON; THREE-DIMENSIONAL MODELING;

AMPLIFIER; ARTICLE; DEVICE; ELASTICITY; ELECTRONICS; FINITE ELEMENT ANALYSIS; INSULATOR ELEMENT; INTEGRATED CIRCUIT; PRIORITY JOURNAL; QUANTITATIVE ANALYSIS; SCANNING ELECTROCHEMICAL MICROSCOPY; SEMICONDUCTOR; SIMULATION;

EID: 42549116193     PISSN: 00368075     EISSN: 10959203     Source Type: Journal    
DOI: 10.1126/science.1154367     Document Type: Article

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32. We thank T. Banks and K. Colravy for help with processing. The materials parts of this effort were supported by the U.S. Department of Energy (DoE), Division of Materials Sciences under award DE-FG02-07ER46471, through the Materials Research Laboratory (MRL). The general characterization facilities were provided through the MRL with support from the University of Illinois and from DoE grants DE-FG02-07ER46453 and DE-FG02-07ER46471. The mechanics theory and the transfer printing systems were developed under support from the Center for Nanoscale Chemical Electrical Mechanical Manufacturing Systems at the University of Illinois (funded by the NSF under grant DMI-0328162).