Liquid cooling of non-uniform heat flux of a chip circuit by subchannels

Applied Thermal Engineering

Volumn 115, Issue , 2017, Pages 558-574

  Al Waaly, Ahmed A Y ^a,b   Paul, Manosh C ^a   Dobson, Phillip ^a  

^a UNIVERSITY OF GLASGOW   (United Kingdom)

^b WASIT UNIVERSITY   (Iraq)

Author keywords

Circuit cooling; Heat sink; Heat transfer; Microchannel fabrication; Numerical simulation; Subchannels

Indexed keywords

ATMOSPHERIC TEMPERATURE; COMPUTER SIMULATION; GRAVITATION; HEAT SINKS; HEAT TRANSFER; MASS TRANSFER; MICROCHANNELS; THERMOCOUPLES; TIMING CIRCUITS;

EXPERIMENTAL AND NUMERICAL ANALYSIS; MAXIMUM TEMPERATURE; MICROCHANNEL FABRICATION; NON-UNIFORM HEAT FLUXES; PARALLEL CHANNEL; SUBCHANNELS; SURFACE TEMPERATURES; WATER CONTAINERS;

HEAT FLUX;

EID: 85009064337     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2016.12.061     Document Type: Article

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