Development of highly-sensitive and ultra-thin silicon stress sensor chips for wearable biomedical applications

Sensors and Actuators, A: Physical

Volumn 216, Issue , 2014, Pages 158-166

  Zhao, Pai ^a   Deng, Ning ^a,b   Li, Xiaowei ^c   Ren, Chaochao ^c   Wang, Zheyao ^a,b  

^a TSINGHUA UNIVERSITY   (China)

^b Innovation Center for MicroNanoelectronics and Integrated System   (China)

^c CAPITAL MEDICAL UNIVERSITY   (China)

Author keywords

Othodontic force; Pulse measurement; Thinning; Ultra thin stress sensor chip; Wearable sensor

Indexed keywords

CMOS INTEGRATED CIRCUITS; MEDICAL APPLICATIONS; SENSORS; SILICON; SILICON WAFERS; STRESS MEASUREMENT;

OTHODONTIC FORCE; PULSE MEASUREMENTS; STRESS SENSOR; THINNING; WEARABLE SENSORS;

WAFER BONDING;

EID: 84902772678     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2014.05.018     Document Type: Article

References (49)

1. D. Briand, Francisco, A.V. Molina-Lopez, C. Quintero, J. Ataman, N.F. Courbat, and de Rooij Why going towards plastic and flexible sensors? Procedia Eng. 25 2011 8 15
2. A. Pantelopoulos, and N.G. Bourbakis A survey on wearable sensor-based systems for health monitoring and prognosis IEEE Trans. Syst. Man Cybern. Pt. C 40 2010 1 12
3. J.N. Burghartz, W. Appel, C. Harendt, H. Richter, and M. Zimmermann Ultra-thin chip technology and applications a new paradigm in silicon technology Solid-State Electron. 54 2010 818 829
4. C. Pang, C. Lee, and K.-Y. Suh Recent advances in flexible sensors for wearable and implantable devices J. Appl. Polym. Sci. 130 2013 1429 1441
5. J.R. Windmiller, and J. Wang Wearable electrochemical sensors and biosensors: a review Electroanalysis 25 2 2013 29 46
6. P. Alpuim, V. Correia, E.S. Marins, J.G. Rocha, I.G. Trindade, and S. Lanceros-Mendez Piezoresistive silicon thin film sensor array for biomedical applications Thin Solid Films 519 2011 4574 4580
7. 2 thin films on PVDF substrates for sensors and actuators applications Thin Solid Films 517 2008 1161 1166
8. A. Oprea, J. Courbat, N. Bârsan, D. Briand, N.F. de Rooij, and U. Weimar Temperature, humidity and gas sensors integrated on plastic foil for low power applications Sens. Actuators B 140 2009 227 232
9. F. Molina-Lopez, D. Briand, and N.F. de Rooij All additive inkjet printed humidity sensors on plastic substrate Sens. Actuators B 166-167 2012 212 222
10. E.G.R. Kim, J.K. John, H. Tua, Q. Zheng, J. Loeb, J. Zhang, and Y. Xu A hybrid silicon-parylene neural probe with locally flexible regions Sens. Actuators B 195 2014 416 422
11. P.-G. Su, and C.-C. Shiu Electrical and sensing properties of a flexible humidity sensor made of polyamidoamine dendrimer-Au nanoparticles Sens. Actuators B 165 2012 151 156
12. E. Skotadis, D. Mousadakos, K. Katsabrokou, S. Stathopoulos, and D. Tsoukalas Flexible polyimide chemical sensors using platinum nanoparticles Sens. Actuators B 189 2013 106 112
13. A. Pecora, L. Maiolo, F. Maita, and A. Minotti Flexible PVDF-TrFE pyroelectric sensor driven by polysilicon thin film transistor fabricated on ultra-thin polyimide substrate Sens. Actuators A 185 2012 39 43
14. L. Maiolo, A. Pecora, F. Maita, A. Minotti, E. Zampetti, S. Pantalei, A. Macagnano, A. Bearzotti, D. Ricci, and G. Fortunato Flexible sensing systems based on polysilicon thin film transistors technology Sens. Actuators B 179 2013 114 124
15. G. Fortunato, A. Pecora, and L. Maiolo Polysilicon thin-film transistors on polymer substrates Mater. Sci. Semicond. Process. 15 2012 627 641
16. K. Parikh, K. Cattanach, R. Rao, D.-S. Suh, A. Wu, and S.K. Manohar Flexible vapor sensors using single walled carbon nanotubes Sens. Actuators B 113 2006 55 63
17. E. Zampetti, S. Pantalei, A. Pecora, A. Valletta, L. Maiolo, A. Minotti, A. Macagnano, G. Fortunato, and A. Bearzotti Design and optimization of an ultra thin flexible capacitive humidity sensor Sens. Actuators B 143 2009 302 307
18. R.S. Dahiya, A. Adami, C. Collini, and L. Lorenzelli Fabrication of single crystal silicon micro-/nanostructures and transferring them to flexible substrates Microelectron. Eng. 98 2012 502 507
19. H. Sturm, and W. Lang Membrane-based thermal flow sensors on flexible substrates Sens. Actuators A 195 2013 113 122
20. G. Kunkel, T. Debski, H. Burkard, J. Link, A.E. Petersen, W. Christiaens, and J. Vanfleteren Ultra-flexible and ultra-thin embedded medical devices on large area panels IEEE Elect. Syst. Integ. Technol. Conf. 2010 1 3
21. F. Jiang, G.-B. Lee, Y.-C. Tai, and C.-M. Ho A flexible micromachine-based shear-stress sensor array and its application to separation-point detection Sens. Actuators A 79 2000 194 203
22. S. Pinel, J. Tasselli, J.P. Bailbe, A. Marty, P. Puech, and D. Esteve Mechanical lapping, handling and transfer of ultra-thin wafer J. Micromech. Miceoeng. 8 1998 338 342
23. T. Sterken, J. Vanfleteren, T. Torfs, M.O.de. Beeck, F. Bossuyt, and C.V. Hoof Ultra-thin chip package (UTCP) and stretchable circuit technologies for wearable ECG system IEEE. Eng. Med. Biol. Soc. Conf. 2011 6886 6890
24. S. Chen, T.Y. Kuo, H.T. Hu, J.R. Lin, and S.P. Yu The evaluation of wafer thinning and singulating processes to enhance chip strength IEEE. Elect. Comp. Technol. Conf. 2005 1526 1530
25. V.P. Ganesh, and C. Lee Overview and emerging challenges in wafer thinning process for handheld applications IEEE Intl. Elect. Manuf. Technol. Conf. 2006 20 26
26. H. Tu, and Y. Xu A silicon-on-insulator complementary-metal-oxide- semiconductor compatible flexible electronics technology Appl. Phys. Lett. 101 2012 052106
27. J.N. Burghartz, W. Appel, H.D. Remmp, and M. Zimmermann A new fabrication and assembly process for ultrathin chips IEEE Trans. Electron Dev. 56 2009 321 327
28. S. Takyu, T. Kurosawa, N. Shimizu, and S. Harada Novel wafer dicing and chip thinning technologies realizing high chip strength IEEE Elect. Comp. Technol. Conf. 2006 1623 1627
29. S. Takyu, J. Sagara, and T. Kurosawa A study on chip thinning process for ultra-thin memory IEEE Elect. Comp. Technol. Conf. 2008 1511 1516
30. G.C. Dogiamis, B.J. Hosticka, and A. Grabmaier Investigations on an ultra-thin bendable monolithic Si CMOS image sensor IEEE Sens. J. 13 2013 3892 3900
31. X. Zhang, A. Kumar, Q.X. Zhang, Y.Y. Ong, S.W. Ho, C.H. Khong, V. Kripesh, J.H. Lau, D.-L. Kwong, V. Sundaram, R.R. Tummula, and G. Meyer-Berg Application of piezoresistive stress sensors in ultra thin device handling and characterization Sens. Actuators A 156 2009 2 7
32. V. Correia, V. Sencadas, M.S. Martins, C. Ribeiro, P. Alpuim, J.G. Rocha, I. Morales, C. Atienza, and S. Lanceros-Mendez Piezoresistive sensors for force mapping of hip-prostheses Sens. Actuators A 195 2013 133 138
33. S. Endler, S. Ferwana, H. Rempp, C. Harendt, and J.N. Burghartz Two-Dimensional flex sensor exploiting stacked ultrathin chips IEEE Electron Dev. Lett. 33 2012 444 446
34. P. Alpuim, V. Correia, E.S. Marins, J.G. Rocha, I.G. Trindade, and S. Lanceros-Mendez Piezoresistive silicon thin film sensor array for biomedical applications Thin Solid Films 519 2011 4574 4577
35. S. Uhlig, S. Rau, and G. Schultes Piezoresistivity of polycrystalline silicon applying the AIC process-route Sens. Actuators A 172 2011 447 454
36. S. Ferwana, E.A. Angelopoulos, S. Endler, C. Harendt, and J.N. Burghartz A flexible stress sensor using a sub-10 μm silicon chip technology Transducers 2013 2628 2631
37. Y. Wang, A.X. Wang, Y. Wang, M.K. Chyu, and Q.-M. Wang Fabrication and characterization of carbon nanotube-polyimide composite based high temperature flexible thin film piezoresistive strain sensor Sens. Actuators A 199 2013 265 271
38. B.G. Lapatki, J. Bartholomeyczik, P. Ruther, I.E. Jonas, and O. Paul Smart bracket for multi-dimensional force and moment measurement J. Dent. Res. 86 2007 73 78
39. Y. Shi, C. Ren, W. Hao, M. Zhang, Y. Bai, and Z. Wang An ultra-thin piezoresistive stress sensor for measurement of tooth orthodontic force in invisible aligners IEEE Sens. J. 12 2012 1090 1097
40. N.N. Li, S.W. He, Q.C. Zhao, S.B. Zhang, and J. Chen Non-planar surface bonding with spray-coated SU-8 as adhesive layer Micro Nano Lett. 7 2012 1220 1222
41. A.A. Barlian, W.T. Park, J.R. Mallon, A.J. Rasteger, and B.L. Pruitt Semiconductor piezoresistance for microsystems Proc. IEEE. 97 2009 513 552
42. Y. Chen, R.C. Jaeger, and J.C. Suhling CMOS sensor arrays for high resolution die stress mapping in packaged integrated circuits IEEE Sens. J. 13 2013 2066 2086
43. X. Feng, Y. Huang, H. Jiang, D. Ngo, and A.J. Rosakis The effect of thin film/substrate radii on the stoney formula for thin film/substrate subjected to non-uniform axisymmetric misfit strain and temperature J. Mech. Mater. Struct. 1 2006 1041 1053
44. S.L. Holl, C.A. Colinge, S. Song, R. Varasala, K. Hobart, and F. Kub Fabrication techniques for thin film silicon layer transfer ECS Trans. 3 2006 67 73
45. J. Chen, L. Liu, Z. Li, Z. Tan, Q. Jiang, H. Fang, Y. Xu, and Y. Liu Study of anisotropic etching of (1 0 0) Si with ultrasonic agitation Sens. Actuators A 96 2002 152 156
46. J.F. Martin, L.B. Volfson, V.V. Kirzon-Zolin, and V.G. Schukin Application of pattern recognition and image classification techniques to determine continuous cardiac output from the arterial pressure waveform IEEE Trans. Biomed. Eng. 41 1994 913 920
47. J.-H. Wu, R.-S. Chang, and J.-A. Jiang A novel pulse measurement system by using laser triangulation and a CMOS image sensor Sensors 7 2007 3366 3385
48. N. Brezniak, and A. Wasserstein Root resorption following treatment with aligners Angle Orthod. 78 2008 1119 1124
49. W.R. Womack, and R.H. Day Surgical-orthodontic treatment using the Invisalign system J. Clin. Orthod. 42 2008 237 245