Flip chip assembly of thinned silicon die on flex substrates

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 31, Issue 1, 2008, Pages 1-8

  Banda, Charles ^a   Johnson, R Wayne ^b   Zhang, Tan ^b,c   Hou, Zhenwei ^b,d   Charles, Harry K ^e  

^a LABORATORY FOR PHYSICAL SCIENCES   (United States)

^b AUBURN UNIVERSITY   (United States)

^c GE GLOBAL RESEARCH   (United States)

^d SEAGATE TECHNOLOGY   (United States)

^e JOHNS HOPKINS UNIVERSITY APPLIED PHYSICS LABORATORY   (United States)

Author keywords

Flexible circuits; Flip chip; Microassembly; Thin circuits; Thin film circuit bonding

Indexed keywords

FLEXIBLE MANUFACTURING SYSTEMS; MULTICHIP MODULES; POLYIMIDES; RELIABILITY; SEMICONDUCTING SILICON; THIN FILM CIRCUITS;

MICROASSEMBLY; THINNED SILICON DIE; UNDERFILL DISPENSE PROCESS;

FLIP CHIP DEVICES;

EID: 39449101441     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.914217     Document Type: Article

References (12)

1. D. New, "Silicon thinning and stacked packages," in Proc. 27th Annu. IEEE/SEMI Int. Electron. Manuf. Technol. Symp. (IEMT'02)., Jul. 17-18, 2002, pp. 50-52.
2. M. Hendrix, S. Drews, and T. Hurd, "Advantages of wet chemical spin-processing for wafer thinning and packaging applications," in Proc. 26th IEEE/CPMT Int. Electron. Manuf. Technol. Symp., Oct. 2-3, 2000, pp. 229-236.
3. M. Feil, C. D. Adler, M. H. Konig, and K. Bock, "The challenge of ultra thin chip assembly," in Proc. Electron. Compon. Technol. (ECTC'04) Jun. 1-4, 2004, vol. 1, pp. 35-40.
4. L. J. C. Wu and C. S. Hsiao, "Cost-performance wafer thinning technology," in Proc. 53rd Electron. Compon. Technol. Conf., May 27-30, 2003, pp. 1463-1467.
5. E. Jung, A. Ostmann, D. Wojakowski, C. Landesberger, R. Aschenbrenner, and H. Reichl, "Ultra thin chips for miniaturized products," in Proc. 1st Int. IEEE Conf. Polymers Adhesives Microelectron. Photon., Oct. 21-24, 2001, pp. 236-240.
6. B. Pahl, C. Kallmayer, R. Aschenbrenner, and H. Reichl, "Ultrathin assemblies on flexible substrates," in Proc. 7th Electron. Packag. Technol. Conf. EPTC'05, Dec. 7-9, 2005, vol. 2, pp. 652-657.
7. T. Noll, K. Jayaraj, B. Farrell, T. Perkins, and D. Glynn, "Low-cost phased array antenna packaging technology," in Proc. 20th Annu. Antenna Applicat. Symp., Monticello, IL, 1996.
8. S. Kyu-Ho, M. Chang-Youl, L. Tae-Hee, L. Chang-Hyun, and K. Young-Jun, "Implantable flexible wireless pressure sensor module," in Proc. IEEE Sensors, Oct. 24-27, 2004, vol. 2, pp. 844-847.
9. E. J. Vardaman, Flexible Circuits for High Density Applications. Austin, TX: TechSearch Int., 2000.
10. K. Chen, R. Zenner, M. Arneson, and D. Mountain, "Ultra-thin electronic device package," IEEE Trans. Adv. Packag., vol. 23, no. 1, pp. 22-26, Feb. 2000.
11. Balde and W. John, Foldable Flex and Thinned Silicon Multichip Packaging Technology. Norwell, MA: Kluwer, 2003.
12. N. R. Draney, J. L. Jun, and T. Jiang, "Experimental investigation of bare silicon wafer warp," in Proc. IEEE Workshop Microelectron. Electron Devices, pp. 120-123.