Modification of the surface properties of polyimide films using polyhedral oligomeric silsesquioxane deposition and oxygen plasma exposure

Applied Surface Science

Volumn 255, Issue 18, 2009, Pages 8135-8144

  Wohl, Christopher J ^a   Belcher, Marcus A ^b   Ghose, Sayata ^b   Connell, John W ^c  

^a National Institute of Aerospace ^*

^b NATIONAL INSTITUTE OF AEROSPACE   (United States)

^c NASA LANGLEY RESEARCH CENTER   (United States)

Author keywords

Lunar dust; Oxygen plasma; Polyhedral oligomeric silsesquioxane; Polyimide

Indexed keywords

DUST; INTERFACIAL ENERGY; OLIGOMERS; OXYGEN; POLYIMIDES; SCANNING ELECTRON MICROSCOPY;

ADHESIVE INTERACTION; HIGH-RESOLUTION SCANNING ELECTRON MICROSCOPIES; LUNAR DUST; LUNAR DUST SIMULANT; OXYGEN PLASMA EXPOSURE; OXYGEN PLASMAS; POLYHEDRAL OLIGOMERIC SILSESQUIOXANES; WATER CONTACT ANGLE;

SURFACE TOPOGRAPHY;

EID: 67549086076     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2009.05.030     Document Type: Article

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