A 10 um thick RF-ID tag for chip-in-paper applications

Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting

Volumn , Issue , 2005, Pages 18-21

  Dekker, R ^a   Dumling M ^b   Fock, J H ^c   Gourhant, O ^d   Jonville, C ^d   Michielsen, T M ^a   Pohlmann, H ^c   Schnitt, W ^c   Tombeur, A M H ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

^c PHILIPS RESEARCH LABORATORIES   (Germany)

^d Grenoble INP Phelma   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNAS; NETWORKS (CIRCUITS); POLYIMIDES; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

CHIP-IN-PAPER APPLICATIONS; CIRCONFLEX TECHNOLOGY; INTEGRATED ANTENNAS;

MICROPROCESSOR CHIPS;

EID: 27944500302     PISSN: 10889299     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. R. Dekker, et al., "CIRCONFLEX: an ultra-thin and flexible technology for RF-ID tags," in 15th European Microelectronics and Packaging Conference & Exhibition (IMAPS), June 12-15, Brugge Belgium, 2005
2. R. Dekker, et al., "Substrate Transfer for RF Technologies," IEEE Transactions on Electron Devices, pp. 747-759, March 2003
3. R. Dekker. et al., "An ultra low power lateral bipolar poly-silicon emitter technology," in IEEE Int. Electron Devices Meeting (IEDM) Tech. Dig., 1993, pp. 75-78