Active cooling of integrated circuits and optoelectronic devices using a micro configured thermoelectric and fluidic system

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2000, Pages 134-139

  Yu, Enchao ^a   Wang, DeMing ^a   Kim, Sura ^a   Przekwas, Andrzej ^a  

^a CFD RESEARCH CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING; HEAT PUMP SYSTEMS; INTEGRATED OPTOELECTRONICS; MATHEMATICAL MODELS; TEMPERATURE;

HEAT REMOVAL; INTEGRATED THERMOELECTRIC FLUIDIC COOLER;

THERMOELECTRIC EQUIPMENT;

EID: 0033678363     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)