Silicon-on-Insulator (SOI) wafer-based thin-chip fabrication

Ultra-thin Chip Technology and Applications

Volumn , Issue , 2011, Pages 61-67

  Burghartz, Joachim N ^a  

^a Institut fur Mikroelektronik Stuttgart   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84892084701     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-7276-7_7     Document Type: Chapter

References (9)

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3. Manasevit HM, Simpson WJ (1964) Single-crystal silicon on a sapphire substrate. J Appl Phys 35:1349-1351
4. Collinge JP (1991) Silicon-on-insulator technology: materials to VLSI. Springer, New York
5. Tong Q-Y, Goesele U (1998) Semiconductor wafer bonding: science and technology. Wiley-Interscience, New York
6. Soitec (2010) http://www.soitec.com/en/technology/smart-cut-smart-choice. php
7. Dekker R et al. (2003) Substrate transfer: enabling technology for RF applications. International electron device meeting (IEDM) Dig. Techn. P., San Francisco, pp 371-374, 2003
8. Dekker R et al. (2005) Circonflex: an ultrathin and flexible technology for RF-ID tags. In: Proceedings of the 15th European microelectronics and packaging conference, Bruges
9. Zoumpoulidis T (2010) Electronics on flexible and stretchable silicon arrays. Ph. D. thesis, TU Delft