An introduction to thin film processing using high-power impulse magnetron sputtering

Journal of Materials Research

Volumn 27, Issue 5, 2012, Pages 780-792

  Lundin, Daniel ^a   Sarakinos, Kostas ^a  

^a LINKÖPING UNIVERSITY   (Sweden)

Author keywords

Physical vapor deposition; Plasma deposition; Thin film

Indexed keywords

CHEMICAL COMPOSITIONS; CONVENTIONAL MAGNETRON SPUTTERING; DEPOSITION CONDITIONS; DEPOSITION METHODS; EMERGING TECHNOLOGIES; GENERAL TRENDS; HIGH-POWER; HIGHLY DENSE; IONIZED PHYSICAL VAPOR DEPOSITION; LOW DUTY FACTOR; LOW FREQUENCY; MATERIAL SYSTEMS; MODE OF OPERATIONS; PHASE FORMATIONS; PLASMA PARAMETER; SPUTTERED MATERIALS; TARGET POWER DENSITY; THIN-FILM PROCESSING; THIN-FILM PROPERTIES; UNIPOLAR PULSE;

ELECTRIC DISCHARGES; INDUSTRIAL APPLICATIONS; MAGNETRON SPUTTERING; MAGNETRONS; PHYSICAL VAPOR DEPOSITION; PLASMA DEPOSITION; THIN FILMS; VAPOR DEPOSITION; VAPORS;

DEPOSITION;

EID: 84857802948     PISSN: 08842914     EISSN: 20445326     Source Type: Journal    
DOI: 10.1557/jmr.2012.8     Document Type: Review

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