Copper metallization in microelectronics using filtered vacuum arc deposition - principles and technological development

Surface and Coatings Technology

Volumn 133-134, Issue , 2000, Pages 106-113

  Siemroth, P ^a   Schulke T ^b  

^a FRAUNHOFER INSTITUTE FOR MATERIAL AND BEAM TECHNOLOGY IWS   (Germany)

^b Fraunhofer USA Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC ARCS; ELECTRIC CONDUCTIVITY OF SOLIDS; EVAPORATION; MAGNETRON SPUTTERING; METALLIZING; MICROELECTRONICS; NITRIDES; PLASMA ETCHING; PLASMA SOURCES; SPUTTER DEPOSITION; TANTALUM COMPOUNDS;

PLASMA VAPOR DEPOSITION; VACUUM ARC DEPOSITION;

VACUUM DEPOSITED COATINGS;

VACUUM DEPOSITION;

EID: 0034506770     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(00)00883-5     Document Type: Article

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