Hysteresis and process stability in reactive high power impulse magnetron sputtering of metal oxides

Thin Solid Films

Volumn 519, Issue 22, 2011, Pages 7779-7784

  Aiempanakit, Montri ^a   Kubart, Tomáš ^b,c   Larsson, Petter ^a   Sarakinos, Kostas ^a   Jensen, Jens ^a   Helmersson, Ulf ^a  

^a LINKÖPING UNIVERSITY   (Sweden)

^b UPPSALA UNIVERSITY   (Sweden)

^c CZECH TECHNICAL UNIVERSITY IN PRAGUE   (Czech Republic)

Author keywords

Aluminum oxide; Cerium oxide; High power impulse magnetron sputtering; Hysteresis; Process stability; Reactive sputtering

Indexed keywords

ALUMINUM OXIDES; CERIUM OXIDE; DIRECT CURRENT MAGNETRON SPUTTERING; EXPERIMENTAL CONDITIONS; FILM PROPERTIES; FURTHER DEVELOPMENT; HIGH DEPOSITION RATES; HIGH POWER IMPULSE MAGNETRON SPUTTERING; HIGH-POWER; HYSTERESIS BEHAVIOR; METAL OXIDES; PROCESS STABILITY; PULSING FREQUENCIES; PUMPING SPEED; REACTIVE SPUTTER DEPOSITION; TRANSITION ZONES;

ALUMINUM; ALUMINUM COATINGS; BEHAVIORAL RESEARCH; CERIUM; CERIUM COMPOUNDS; DEPOSITION RATES; FILM GROWTH; ISOMERS; MAGNETRON SPUTTERING; METALLIC COMPOUNDS; OXIDES; SPUTTER DEPOSITION; STABILIZATION;

HYSTERESIS;

EID: 80052105246     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2011.06.021     Document Type: Article

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