High power pulsed magnetron sputtering: Fundamentals and applications

Journal of Alloys and Compounds

Volumn 483, Issue 1-2, 2009, Pages 530-534

  Alami, J ^a   Bolz, S ^b   Sarakinos, K ^b  

^a Sulzer Metaplas GmbH   (Germany)

^b RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

Atom, molecule, and ion impact; Mechanical properties; Nitride materials; Thin films

Indexed keywords

COATING PROPERTIES; COATING SURFACE; COMPOUND COATING; DEPOSITION TECHNIQUE; DIRECT CURRENT MAGNETRON SPUTTERING; ELECTRICAL AND OPTICAL PROPERTIES; FUNDAMENTAL PROBLEM; HIGH POWER PULSED MAGNETRON SPUTTERING; HIGH VOLTAGE; HIGH-ELECTRON-DENSITY; HIGH-POWER; IN-PROCESS; IONIZATION FRACTIONS; MAGNETIC CONFINEMENT; METALLIC COATING; NITRIDE MATERIALS; PEAK POWER DENSITIES; POWER LEVELS; POWER SUPPLY; RADIO FREQUENCY MAGNETRON SPUTTERING; RF COIL; SPUTTERED MATERIALS; TARGET VOLTAGE; TIALN COATINGS; UNI-POLAR PULSING;

ATOMS; COATINGS; DC GENERATORS; ELECTRIC POTENTIAL; ELECTRIC POWER SYSTEMS; ION BOMBARDMENT; IONIZATION; MAGNETRON SPUTTERING; MAGNETRONS; MATERIALS PROPERTIES; MECHANISMS; NITRIDES; OPTICAL PROPERTIES; RADIO WAVES; TARGETS; THIN FILMS;

MECHANICAL PROPERTIES;

EID: 69249224539     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.08.104     Document Type: Article

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1. Also referred to as high power impulse magnetron sputtering-HiPIMS.
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