Process stabilization and increase of the deposition rate in reactive sputtering of metal oxides and oxynitrides

Applied Physics Letters

Volumn 88, Issue 16, 2006, Pages

  Severin, D ^a   Kappertz, O ^b   Kubart, T ^b   Nyberg, T ^b   Berg, S ^b   Pflug, A ^c   Siemers, M ^c   Wuttig, M ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b UPPSALA UNIVERSITY   (Sweden)

^c FRAUNHOFER INSTITUTE FOR SURFACE ENGINEERING AND THIN FILMS IST   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; GASES; HYSTERESIS; MATHEMATICAL MODELS; METAL ANALYSIS; RATE CONSTANTS;

METAL OXIDES; OXYNITRIDES; REACTIVE GASES; REACTIVE SPUTTERING;

SPUTTER DEPOSITION;

EID: 33646186368     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2196048     Document Type: Article

References (9)

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