A structure zone diagram including plasma-based deposition and ion etching

Thin Solid Films

Volumn 518, Issue 15, 2010, Pages 4087-4090

  Anders, André ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Homologous temperature; Ion etching; Morphology; Plasma assistance; Potential and kinetic energy; Stress; Structure zone diagram; Thin film deposition

Indexed keywords

CATHODIC ARC; EXTENDED STRUCTURES; FLUX OF IONS; GROWTH CONDITIONS; HIGH-POWER; HOMOLOGOUS TEMPERATURE; ION ETCHING; PHYSICAL PARAMETERS; THIN-FILM DEPOSITIONS;

DEPOSITION; ELECTRON ENERGY LOSS SPECTROSCOPY; ETCHING; IONS; KINETIC ENERGY; MORPHOLOGY; THIN FILMS; TOOLS;

PLASMA DEPOSITION;

EID: 77953163625     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.10.145     Document Type: Article

References (39)

1. Movchan B.A., and Demchishin A.V. Fiz. Met. Metalloved. (USSR), (Phys. Met. Metallogr.) vol. 28 (1969) 653
2. Hultman L., and Sundgren J.E. In: Bunshah R.F. (Ed). Handbook of Hard Coatings (2001), Noyes, Park Ridge, NY 108
3. Barna P.B., and Adamik M. Thin Solid Films 317 (1998) 27
4. Thornton J.A. J. Vac. Sci. Technol. 11 (1974) 666
5. Greene J.E. In: Bunshah R.F. (Ed). Handbook of Deposition Technologies for Films and Coatings (1994), Noyes, Westwood, NJ 681
6. Mattox D.M. Handbook of Physical Vapor Deposition (PVD) Processing (1998), Noyes Publications, Park Ridge, N.J.
7. Anders A. Cathodic Arcs: From Fractal Spots to Energetic Condensation (2008), Springer, New York
8. Musil J. Vacuum 50 (1998) 363
9. Thompson M.W. Phila. Mag. 18 (1968) 377
10. Ono T., Kenmotsu T., and Muranoto T. In: Depla D., and Mahieu S. (Eds). Reactive Sputter Deposition (2008), Springer, Berlin 1
11. Messier R., Giri A.P., and Roy R.A. J. Vac. Sci. Technol. A 2 (1984) 500
12. Petrov I., Adibi F., Greene J.E., Hultman L., and Sundgren J.E. Appl. Phys. Lett. 63 (1993) 36
13. Mausbach M. Surf. Coat. Technol. 74-75 (1995) 264
14. Colligon J.S. J. Vac. Sci. Technol. A 13 (1995) 1649
15. McKenzie D.R., and Bilek M.M.M. Thin Solid Films 382 (2001) 280
16. Monteiro O.R. Annu. Rev. Mater. Sci. 31 (2001) 111
17. Aksenov I.I., Padalka V.G., Tolok V.T., and Khoroshikh V.M. Sov. J. Plasma Phys. 6 (1980) 504
18. Martin P.J., Bendavid A., and Takikawa H. J. Vac. Sci. Technol. A 17 (1999) 2351
19. Kouznetsov V., Macak K., Schneider J.M., Helmersson U., and Petrov I. Surf. Coat. Technol. 122 (1999) 290
20. Alami J., Persson P.O.A., Music D., Gudmundsson J.T., Bohlmark J., and Helmersson U. J. Vac. Sci. Technol. A 23 (2005) 278
21. Ehiasarian A. In: Wei R. (Ed). Plasma Surface Engineering Research and its Practical Applications, Research Signpost, Kerala, India (2008) 35
22. Chistyakov R., Abraham B., and Sproul W.D. 49th Ann. Tech. Conf. Proc (2006), Society of Vacuum Coaters, Washington, D.C 88
23. Krutenat R.C., and Gesick W.R. J. Vac. Sci. Technol. 7 (1970) S40
24. Posadowski W.M., and Radzimski Z. J. Vac. Sci. Technol. A 11 (1993) 2980
25. Wiatrowski A., Posadowski W.M., and Radzimski Z.J. J. Vac. Sci. Technol. A 26 (2008) 1277
26. Andersson J., and Anders A. Phys. Rev. Lett. 102 (2009) 045003
27. In: Hopwood J.A. (Ed). Ionized Physical Vapor Deposition (2000), Academic Press, San Diego, CA
28. Helmersson U., Lattemann M., Bohlmark J., Ehiasarian A.P., and Gudmundsson J.T. Thin Solid Films 513 (2006) 1
29. Alami J., Eklund P., Andersson J.M., Lattemann M., Wallin E., Bohlmark J., Persson P., and Helmersson U. Thin Solid Films 515 (2007) 3434
30. Anders A., Andersson J., and Ehiasarian A. J. Appl. Phys. 102 (2007) 113303
31. Rossnagel S.M. J. Vac. Sci. Technol. A 9 (1989) 261
32. Mráz S., and Schneider J.M. J. Appl. Phys. 100 (2006) 023503
33. Eckstein W. Computer Simulation of Ion-Solid Interactions (1991), Springer-Verlag, Berlin
34. Brice D.K., Tsao J.Y., and Picraux S.T. Nucl. Instrum. Methods Phys. Res. B 44 (1989) 68
35. Carter G. Phys. Rev. B 62 (2000) 8376
36. Bilek M.M.M., and McKenzie D.R. Surf. Coat. Technol. 200 (2006) 4345
37. Münz W.-D., Schulze D., and Hauzer F.J.M. Surf. Coat. Technol. 50 (1992) 169
38. Ehiasarian A.P., Anders A., and Petrov I. J. Vac. Sci. Technol. A 25 (2007) 543
39. Ehiasarian A.P., Wen J.G., and Petrov I. J. Appl. Phys. 101 (2007) 054301