Process stabilization and enhancement of deposition rate during reactive high power pulsed magnetron sputtering of zirconium oxide

Surface and Coatings Technology

Volumn 202, Issue 20, 2008, Pages 5033-5035

  Sarakinos, K ^a   Alami, J ^a   Klever, C ^a   Wuttig, M ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

Deposition rate; HPPMS HIPIMS; Reactive deposition

Indexed keywords

CHEMICAL VAPOR DEPOSITION; DC GENERATORS; DEPOSITION RATES; MAGNETRONS; OXIDE FILMS; OXIDES; REACTIVE SPUTTERING; SCALE (DEPOSITS); SPUTTER DEPOSITION; STABILIZATION; ZIRCONIA; ZIRCONIUM;

A-STABLE; DEPOSITION RATE; DIRECT CURRENT MAGNETRON SPUTTERING; FILM DEPOSITION RATES; HIGH POWERS; HPPMS HIPIMS; PROCESS STABILIZATION; PULSED MAGNETRON SPUTTERING; REACTIVE DEPOSITION; TARGET COVERAGE; TRANSITION ZONES; ZIRCONIUM OXIDE FILMS; ZIRCONIUM OXIDES;

MAGNETRON SPUTTERING;

EID: 50349099478     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2008.05.009     Document Type: Article

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